LATEST NEWS

Maxim’s Dual Channel Transceiver Adopted by Omron for IO-Link Sensor Applications

Maxim Integrated Products, Inc. (NASDAQ:MXIM) announced that its MAX14827A dual IO-Link® transceiver has been adopted by Omron Corporation. The high-performing device from Maxim, which utilizes IO-Link sensors to reduce maintenance and increase uptime, provides continuous diagnostics and monitoring at Omron’s customers’ production sites. It dissipates > 50% less heat than other solutions and is the smallest solution available.

IO-Link, a standardized IO technology which has rapidly been adopted in Europe, is now tracking on the same growth curve in the Japan market. It has recently been attracting attention as a technology to realize smart factory applications by seamlessly connecting facilities with various plant sensors through digital communications. Recognizing the importance of IO-Link, Maxim has developed a variety of products using IO-Link technology, including products like the MAX14827A IO-Link dual-channel transceiver in new Industry 4.0 applications.

Omron is expanding its IO-Link sensor series primarily in photoelectric and proximity sensors. Equipped with an individual identification confirmation feature and unique ability to detect abnormalities and monitor situations, Omron’s IO-Link sensors deliver solutions that shorten downtime, lower frequency of sudden failures, and increase efficiency in changing arrangements. This enables smarter production facilities by collecting critical data for stable facility operations, with PLCs and other superior controllers, via EtherCAT through a master unit.

IO-Link Overview

IO-Link is the first standardized IO technology worldwide (IEC 61131-9) for communication with sensors and actuators. The powerful point-to-point communication is based on the long established 3-wire sensor and actuator connection using existing cables.

Lihi

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

23 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

23 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

23 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

23 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

23 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

23 hours ago