Categories: Components

Infineon introduces packaged MEMS microphones with a 70 dB signal-to-noise ratio

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is entering the packaged silicon microphone market. With this it is addressing the needs for high performance, low noise MEMS microphones. The analog and digital microphones are based on Infineon’s dual backplate MEMS technology and distinguish themselves with a 70 dB signal-to-noise ratio (SNR). This is combined with an exceptionally low distortion level of 10 percent at a 135 dB sound pressure level (SPL). In a 4 mm x 3 mm x 1.2 mm MEMS package, the microphones are very well suited for high-quality acoustic recordings and far field voice capturing applications.

“This is an expansion of the established high volume bare die MEMS and ASIC business model with our packaging partners around the world,” said Dr. Roland Helm, Senior Director and Head of Product Line Sensors for Infineon’s Power Management and Multimarket Division. “We will continue to strengthen and grow our business with our partners with bare dies; additionally we now address low noise high-end use cases with our two new packaged microphones.”

Current MEMS microphone technology uses a sound wave actuated membrane and a static backplate. Infineon’s dual backplate MEMS technology uses a membrane embedded within two backplates thus generating a truly differential signal. This allows improved high frequency immunity for better audio signal processing and increases the acoustic overload point of 10 percent Total Harmonic Distortion (THD) to 135 dB SPL.

The SNR of 70 dB is an improvement of 6 dB compared to a conventional MEMS microphone. This improvement is equivalent to doubling the distance from which a user can give a voice command that is captured by the microphone. Additionally, the analog and digital microphones have excellent microphone-to-microphone matching (±1 dB sensitivity matching and ± 2° phase matching) which is ideal for implementing in arrays. For this reason the MEMS microphones are a perfect fit for ultra-precise beam forming and noise cancelling.

 

Lihi

Comments are closed.

Recent Posts

BeyondTrust Acquires Entitle, Strengthening Privileged Identity Security Platform with Paradigm Shifting Just-in-Time Access and Identity Governance

Entitle is a pioneering privilege management solution that discovers, manages, and automates just-in-time (JIT) access and modern identity governance and…

2 weeks ago

Samtec Introduces SIBORG Tool to Speed Component Launch Designs

Available freely to Samtec customers under NDA, SIBORG (Signal Integrity Breakout Region Guru) works with Ansys HFSS 3D Layout to…

2 weeks ago

Accelerating Mass Business AI Adoption: NeuReality Launches Developer Portal for NR1 Inference Platform, Expanding Affordable AI Access

Entire NR1 system purpose-built for a more affordable AI infrastructure allowing for faster deployment; furthering AI’s reach into more parts…

2 weeks ago

Dot Compliance Raises a $17.5 Million Up-Round in Series B Extension Funding to Advance New Category of AI-driven Compliance

Following rapid growth in its customer base to over 400, funding will fuel further AI development and create a hybrid…

2 weeks ago

Tektronix and recently acquired EA Elektro-Automatik now offer expanded power portfolio for engineers who are electrifying our world

The addition of EA’s high-efficiency regenerative power supplies greatly expands Tektronix’s trusted offering Tektronix, Inc, a leading provider in test…

3 weeks ago

Melexis unveils fully integrated inductive switch

Melexis reveals its groundbreaking Induxis® switch, the MLX92442. Contactless, magnet-free, and strayfield immune, this monolithic solution directly detects conductive targets.…

3 weeks ago