LATEST NEWS

Qualcomm Announces Flagship Companies to Build Windows 10 PCs Powered by Snapdragon

Today at Computex 2017, Qualcomm Incorporated (NASDAQ: QCOM) through its subsidiary, Qualcomm Technologies, Inc., announced that ASUS, HP and Lenovo are the first original equipment manufacturers (OEM) to develop mobile PCs powered by the Qualcomm® Snapdragon™ 835 Mobile PC Platform featuring the cutting-edge X16 LTE modem.

“Today’s consumers experience mobility in nearly every aspect of their lives and they’ve come to expect more from their PCs than legacy computing models are able to provide,” said Cristiano Amon, executive vice president, Qualcomm Technologies, Inc., and president, QCT. “With compatibility for the Windows 10 ecosystem, the Snapdragon Mobile PC Platform will enable Windows 10 hardware makers to develop next-generation modern device form factors and deliver unparalleled anything, anywhere creation experiences with up to Gigabit Class LTE connectivity.”

Each company is set to produce sleek, thin and fanless PCs running a Windows 10 experience with unparalleled LTE connectivity for an always connected, on the go experience. Coupled with the incredible 10nm leading node efficiency of the Snapdragon 835 Mobile PC Platform, these devices will feature beyond all-day battery life.

“The PC ecosystem continues to evolve, and this evolution requires new innovations in an ever-increasing mobile computing world,” said Jerry Shen, chief executive officer, ASUS. “With the Snapdragon Mobile PC Platform powering our new lineup of Windows 10 devices, our users now can take advantage of new always on, always connected experiences available to them.”

The entire Windows 10 package makes it possible to combine the best of ARM architecture and Qualcomm Technologies engineering on the Snapdragon 835 Mobile PC Platform to bring a cutting edge, hypermobile experience to the consumer laptop space. New PCs will include support for all Windows applications, including Microsoft Office.

The Snapdragon 835 SoC built into the Mobile PC Platform features the Qualcomm® Kryo™ 280 CPU, Qualcomm® Adreno™ 540 GPU and Qualcomm® Hexagon™ 682 DSP, to manage separate heterogenous workloads.

“Today’s PC users want solutions that provide better battery life and the ability to connect anytime, anywhere, while also being lighter and more portable than any other laptop currently available,” said Jeff Meredith, senior vice president and general manager, PCs and smart devices, consumer business segment, Lenovo. “We’re excited to work with Microsoft and Qualcomm Technologies to bring a whole new class of devices to consumers that will change the future of personal computing.”

The Snapdragon 835 provides devices with superior thermal handling and greater power efficiency, enabling fanless designs with longer battery life, attributed to it being on the leading 10nm process node. With an integrated Snapdragon X16 Gigabit LTE modem, devices will be capable of peak download speeds of up to 1Gbps. The Snapdragon 835 Mobile PC Platform will also feature 802.11ac with 2×2 MU-MIMO for optimal Wi-Fi connectivity on the go.

“We are thrilled that OEMs are sharing our vision to bring the Windows 10 experience to the ARM ecosystem, powered by Qualcomm Technologies,” said Matt Barlow, corporate vice president, Windows marketing, Microsoft. “This collaboration offers consumers something new and that they have been craving – the best of a mobile computing experience with the best of Windows 10, all in one thin, light, connected device.”

For more information on Windows 10 PCs powered by the Snapdragon Mobile PC Platform please visit https://www.qualcomm.com/products/snapdragon.

Lihi

Recent Posts

New-Tech Europe | Q3 2026 | Digital Edition

New-Tech Europe | Q3 2026 | Digital Edition

3 days ago

IBM and Together AI Sign Multi-Year Agreement to Scale Open-Source AI Inference with NVIDIA AI Infrastructure on IBM Cloud

First large-scale inference cluster with Together AI on IBM Cloud using NVIDIA HGX B300 systems to help…

3 days ago

Stratasys Secures $7.8M to Advance In-Situ Quality Assurance for Additive Manufacturing

The 24-month program will develop real-time process monitoring capabilities for the F3300 and F900 industrial…

4 days ago

OpenLight and Tower Semiconductor Expand PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA…

4 days ago

Starstone and Ashtrom Industries Sign Industrial Cooperation Agreement to Evaluate Innovative Biogenic Cement Technology

Under the agreement, Ashtrom Industries will evaluate the material's performance and its potential integration into…

5 days ago

Thin-Film Polarizers for High-Power Laser Systems

LASER COMPONENTS has expanded its offering of custom thin-film polarizers (TFPs) for high-power laser applications…

6 days ago