Power Solutions

STMicroelectronics Drives Power-Module Miniaturization with High-Temperature Surface-Mount Silicon Controlled Rectifiers

STMicroelectronics has introduced the industry’s first 800V surface-mount Silicon Controlled Rectifiers (SCR, or thyristor) specified for operation at temperatures up to 150°C without derating, giving freedom to miniaturize power modules for applications that demand high reliability in harsh conditions.

With its 80A current rating, the new TM8050H-8 SCR, housed in the High-Voltage D3PAK (TO-268-HV), enables mid-power applications in the 1-10kW range to leverage surface-mount assembly efficiencies and reduce PCB and heatsink sizes, lowering system cost. The package has very low junction-to-case thermal resistance of 0.25°C/W, ensuring efficient heat dissipation, and a large pin-to-tab creepage distance of 5.6mm that gives a large safety margin in the presence of high applied voltages. A TO-247 package option is also available.

The TM8050H-8 is the latest addition to ST’s family of SCRs that all bring state-of-the-art device and package technologies to automotive and industrial power control. Spanning current ratings from 12A to 80A, the devices enable designers to create extremely compact and reliable car or motorcycle voltage regulators, induction motor starters, soft starters, industrial heater or cooker controls, Solid-State Relays (SSRs), uninterruptible power supplies (UPS), and AC-line conditioners.

With low dynamic resistance (RD) and on-state voltage (VTO) of 5.5 mΩ (TJ = 150°C) and 0.85V respectively, and leakage current of 20µA max (at 800V, Tj = 25°C), the TM8050H-8 ensures extremely high energy efficiency under all operating conditions.

The TM8050H-8 is in production now, priced from $2.20 in TO-247 or $2.50 in High-Voltage D3PAK.

For further information please visit www.st.com/tm8050h-d3pak-nb

Liat

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

4 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

4 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

4 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

4 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

4 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

4 days ago