Categories: LATEST NEWS

KAIST researchers develop ultrathin, transparent oxide thin-film transistors for wearable displays

With the advent of the Internet of Things (IoT) era, strong demand has grown for wearable and transparent displays that can be applied to various fields such as augmented reality (AR) and skin-like thin flexible devices. However, previous flexible transparent displays have posed real challenges to overcome, which are, among others, poor transparency and low electrical performance. To improve the transparency and performance, past research efforts have tried to use inorganic-based electronics, but the fundamental thermal instabilities of plastic substrates have hampered the high temperature process, an essential step necessary for the fabrication of high performance electronic devices.

As a solution to this problem, a research team led by Professors Keon Jae Lee and Sang-Hee Ko Park of the Department of Materials Science and Engineering at the Korea Advanced Institute of Science and Technology (KAIST) has developed ultrathin and transparent oxide thin-film transistors (TFT) for an active-matrix backplane of a flexible display by using the inorganic-based laser lift-off (ILLO) method. Professor Lee’s team previously demonstrated the ILLO technology for energy-harvesting (Advanced Materials, February 12, 2014) and flexible memory (Advanced Materials, September 8, 2014) devices.

The research team fabricated a high-performance oxide TFT array on top of a sacrificial laser-reactive substrate. After laser irradiation from the backside of the substrate, only the oxide TFT arrays were separated from the sacrificial substrate as a result of reaction between laser and laser-reactive layer, and then subsequently transferred onto ultrathin plastics ( thickness). Finally, the transferred ultrathin-oxide driving circuit for the flexible display was attached conformally to the surface of human skin to demonstrate the possibility of the wearable application. The attached oxide TFTs showed high optical transparency of 83% and mobility of  even under several cycles of severe bending tests.

Professor Lee said, “By using our ILLO process, the technological barriers for high performance transparent flexible displays have been overcome at a relatively low cost by removing expensive polyimide substrates. Moreover, the high-quality oxide semiconductor can be easily transferred onto skin-like or any flexible substrate for wearable application.”

These research results, entitled “<span “times=”” new=”” roman”,”serif”;=”” font-size:=”” 11pt;’=””>Skin-Like Oxide Thin-Film Transistors for Transparent Displays,”

(<span “times=”” new=”” roman”,”serif”;=”” font-size:=”” 11pt;’=””>https://onlinelibrary.wiley.com/doi/10.1002/adfm.201601296/abstract) were the lead article published in the July 2016 online issue of Wiley’s Advanced Functional Materials.

 

References

[1] Advanced Materials, February 12, 2014, <span “times=”” new=”” roman”,”serif”;=”” font-size:=”” 11pt;’=””>Highly-efficient, Flexible Piezoelectric PZT Thin Film Nanogenerator on Plastic Substrates

(https://onlinelibrary.wiley.com/doi/10.1002/adma.201305659/abstract)

 

[2] Advanced Materials, September 8, 2014, <span “times=”” new=”” roman”,”serif”;=”” font-size:=”” 11pt;’=””>Flexible Crossbar-structured Resistive Memory Arrays on Plastic Substartes via Inorganic-based Laser Lift-off

(https://onlinelibrary.wiley.com/doi/10.1002/adma.201402472/abstract)

This image shows ultrathin, flexible, and transparent oxide thin-film transistors produced via the ILLO process.

Picture 1: LEFT A Schamatic Image of Ultrathin, Flexible, and Transparent Oxide Thin-film Transistors  Picture 2: RIGHT Application of Uultrathin, Flexible, and Transparent Oxide Thin-film Transistors

This picture shows ultrathin, flexible, and transparent oxide thin-film transistors attached to a jumper sleeve and human skin.

 

Liat

Recent Posts

Renesas Unveils Industry’s First 650V GaN in Dual-Side Cooled 8x8mm Package for Megawatt-Scale AI Data Centers

Dual-side cooling (DSC) shrinks package footprint by 57% compared with TOLT, packing more power into…

21 hours ago

Leica Microsystems launches AI software module for consistent inspection decisions

Supporting manufacturers with reliable defect identification and scalable quality control across production lines Leica Microsystems,…

21 hours ago

Teradyne Introduces Near-DUT Test Platform for LPDDR6, DDR6 and GDDR7

The Magnum E2 system supports emerging DRAM and NAND interfaces while using common hardware and…

21 hours ago

ARX Robotics and DEUTZ Deliver First Ulm-Built GEREON UGVs to Ukraine

The first unmanned ground systems left the production line only 12 weeks after the two…

21 hours ago

AMD Releases Ross Agentic Assistant for Vivado and Vitis HLS Workflows

The available-now engineering assistant connects language models to AMD development tools, documentation and reusable FPGA…

21 hours ago

Murata Begins Mass Production of 0201-Inch Three-Terminal Low-ESL MLCCs

The 0.6 × 0.3 mm capacitors occupy 64% less mounting area than Murata’s previous smallest…

22 hours ago