Toshiba Launches Photorelays for Semiconductor Testers in Industry’s Smallest Package

The new product, “TLP3406S”, utilizes the industry’s smallest package for photorelays, the Toshiba-developed S-VSON4 package. Compared to Toshiba’s previous products in a VSON4 package, the new photorelay has an approximately 22.5%^[2] smaller assembly area, which can contribute to the development of smaller test boards and also make it possible to increase the number of photorelays on a board to increase density. Since the new photorelay can drive large currents of up to 1.5A, in spite of its small package, it can be used in device power supplies (DPS) that make up the power supply circuits in various testers. As a further positive, the operating temperature range has been enhanced from 85 degrees Celsius (max.) to 110 degrees Celsius (max.).