Categories: NEW PRODUCTS

Toshiba Launches Large-current Control Photorelays in Small Packages

TOKYO—Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of large-current control photorelays, for currents in the range of 1.7A to 4A, in 2.54SOP4 and 2.54SOP6 small packages. Shipments start from today. Applications for the new line-up of four products, TLP3106, TLP3107, TLP3109 and TLP3127, include programmable logic controllers (PLC), battery management systems (BMS) and factory automation inverters. The new photorelays utilize Toshiba’s latest generation trench MOSFETs to control large currents at levels equivalent those usually handled by mechanical relays[1]. Compared to mechanical relays, which have mechanical contacts, photorelays have the advantages of producing less noise and no deterioration caused by the contacts wearing.

In the case of the new 2A product, TLP3109, use of a 2.54SOP6 package reduces mounting volume by approximately 40% and the product height by approximately 50%, against Toshiba previous products in DIP packages. The small size allows mounting on the back surface of printed circuit boards and can contribute to smaller sets. Furthermore, the line-up includes products with terminal voltages (blocking voltages) of up to 100V for use in various applications.

Main Specifications

(@Ta=25℃)

Part Number Package Absolute Maximum Ratings RON typ. (Ω) IOFF max.
(nA)
VOFF
(V)
ION
(A)
BVS
(Vrms)
TLP3106 2.54SOP6 30 4 1500 0.02 20
TLP3107 60 3.3 0.03
TLP3109 100 2 0.04
TLP3127 2.54SOP4 60 1.7 0.08 10

Notes

[1] Small capacity, small-size mechanical relays for printed circuit boards.

Liat

Recent Posts

Analog Devices to Acquire Alif Semiconductor for $1.35 Billion, Expanding Its Edge AI Platform

The planned acquisition will combine Analog Devices’ sensing, signal-processing, power and connectivity technologies with Alif’s…

1 day ago

Kyocera and Tohoku University Integrate Optical Isolator Directly on Silicon Photonics

A locally applied laser-annealing process enabled the researchers to crystallise magneto-optical garnet without exposing the…

1 day ago

NVIDIA and Palantir Deploy AI Stack to Manage NVIDIA’s Supply Chain

The system combines NVIDIA Nemotron open models with Palantir Foundry, AIP and Ontology. Its first…

4 days ago

Infineon extends collaboration with SolarEdge to enable solid-state protection for 800 VDC AI data centers

Companies extend collaboration into solid-state circuit breaker (SSCB) technology in line with leading industry framework…

5 days ago

Toyota and Rivian Adopt Stratasys’ New F870™ to Accelerate Factory-Floor Manufacturing Applications at Scale

New industrial FDM® platform expands Stratasys' production-grade portfolio with the longest heated build capacity in…

5 days ago

Imec advances scalable superconducting technology with world-first NbTiN circuits and 30nm interconnects

New superconducting digital program brings together foundries, system companies and hyperscalers around industry needs in…

6 days ago