Micron Introduces Industry’s Best-in-Class SLC NAND Flash for IoT and Automotive

BOISE, Idaho, July 07, 2016 (GLOBE NEWSWIRE) — Micron Technology, Inc. (NASDAQ:MU), today announced its newest embedded SLC NAND Flash optimized for the next generation of Internet of Things (IoT) and automotive applications. Available with differing interfaces to accommodate design,  Micron’s second generation Serial (SPI) NAND and fifth generation parallel SLC NAND, offers the industry’s best-in-class reliability¹ and read and program performance, ease of design and advanced security features.

Gartner projects that the IoT endpoint hardware and services market will rise to a $3.5 trillion industry by 2020². As system designers seek embedded solutions to power the performance for the connected home, wearables and the connected car, the technical demands have raised the bar for the security and seamlessness for ingredient semiconductor suppliers. Micron’s newest SLC NAND addresses these needs for high-performance storage technology to propel the market forward.

“Micron works closely with chipset partners and customers within the ecosystem to design tomorrow’s products that meet the complex NAND requirements fueled by IoT and automotive,” said Aravind Ramamoorthy, product line director of NAND flash for Micron’s Embedded Business Unit. “The new SLC NAND Flash technology enable a new category of embedded applications that need reliable, high-performance, low pin count and secure⁴ memory for code and low density data storage.”

In order to simplify system design and speed time-to-market, Micron has engaged with leading semiconductor and system designers, to ensure that Micron’s newest NAND Flash exceeds the data storage and memory needs for up-and-coming products.

Ecosystem Enablement for Partner Innovation  
“Broadcom is committed to bringing the best features and cutting edge technologies to our customers. We are delighted to see Micron launch Serial NAND product offerings which provide our customers with a new cost-effective option for high-density non-volatile memory,” said Dr. John Liberati, associate technical director, Broadcom Corporation.

“Design teams can reduce their time-to-market, design effort, and risk for automotive and IoT SoC designs by utilizing Cadence’s proven Quad SPI controller and PHY IP solutions with Micron’s latest SPI NAND devices,” said Hugh Durdan, vice president of product marketing for design IP at Cadence. “Cadence and Micron have a long history of collaboration to provide customers with solutions for emerging memory interface standards. The increased density of SPI NAND devices is appealing to our mutual customers who need the faster data access speeds and lower power consumption of NAND Flash interfaces enabled by the Quad SPI standard.”

SLC NAND Flash: High-Performance Storage for Connected Everything
Micron’s newest SLC NAND offers several competitive technical advantages. For drop-in compatibility in both legacy and new applications, new features and enhancements include:

• Best-in-class reliability, program and read performance delivers optimal data retention and fast boot with industry-leading 133Mhz SPI³ interface
• Industry’s first 2x nm NAND with best-in-class program and read performance and best-in-class reliability (10 year uncycled data retention at 85°C and 100K P/E) for small form factor fanless designs and robust storage of critical boot code in environments including automotive
• On-die error correction code (ECC) supported for both parallel NAND and SPI interfaces
• Advanced security⁴ features include permanent block locking and one time programmable data (OTP) capability, ensure protection at the deepest level of connected industrial, consumer, home and automotive applications
• Low pin count SPI NAND interface reduces cost while enabling cost-effective code and data storage option in small form factors

1, 2, and 4 Gb densities are available in SPI and parallel NAND product solutions.