Categories: Power Solutions

Revolutionize high-performance power conversion with TI’s 600-V GaN FET power stage

The first publicly sampled, TI-manufactured integrated high-voltage GaN FET and driver solution enables twice the power density and half the power loss

DALLAS (April 25, 2016) – Building on decades of power-management innovation, Texas Instruments (TI) (NASDAQ: TXN) today announced the availability of  600-V gallium nitride (GaN) 70-mΩ field-effect transistor (FET) power-stage engineering samples, making TI the first and only semiconductor manufacturer to publicly offer a high-voltage driver-integrated GaN solution. The new 12-A LMG3410 power stage coupled with TI’s analog and digital power-conversion controllers enables designers to create smaller, more efficient and higher-performing designs compared to silicon FET-based solutions. These benefits are especially important in isolated high-voltage industrial, telecom, enterprise computing and renewable energy applications. For more details, see www.ti.com/lmg3410-pr-eu .

“With over 3 million hours of reliability testing, the LMG3410 gives power designers the confidence to realize the potential of GaN and to rethink their power architecture and systems in ways not feasible before,” said Steve Lambouses, TI vice president of high-voltage power solutions. “Expanding on TI’s reputation for manufacturing capability and extensive system-design expertise, the new power stage is a significant step for the GaN market.”

With its integrated driver and features such as zero reverse-recovery current, the LMG3410 provides reliable performance, especially in hard-switching applications where it can dramatically reduce switching losses by as much as 80 percent. Unlike stand-alone GaN FETs, the easy-to-use LMG3410 integrates built-in intelligence for temperature, current and undervoltage lockout (UVLO) fault protection.

Proven manufacturing and packaging expertise

The LMG3410 is the first semiconductor integrated circuit (IC) to include GaN FETs manufactured by TI. Building on years of expertise in manufacturing and process technologies, TI creates its GaN devices in a silicon-compatible factoryand qualifies them with practices that are beyond the typical Joint Electron Device Engineering Council (JEDEC) standards to ensure the reliability and robustness of GaN for demanding use cases. Easy-to-use packaging will help increase the adoption of GaN power designs in applications such as power factor controller (PFC) AC/DC converters, high-voltage DC bus converters and photovoltaic (PV) inverters.

Key features and benefits of the LMG3410

  • Double the power density. The 600-V power stage delivers 50 percent lower power losses in a totem-pole PFC compared with state-of-the-art silicon-based boost power-factor converters. The reduced bill of materials (BOM) count and higher efficiency enable a reduction in power-supply size of as much as 50 percent.
  • Reduced packaging parasitic inductance. The new device’s 8-mm-by-8-mm quad flat no-lead (QFN) package decreases power loss, component voltage stress and electromagnetic interference (EMI) compared to discrete GaN solutions.
  • Enables new topologies. GaN’s zero reverse-recovery charge benefits new switching topologies, including totem-pole PFC and LLC topologies to increase power density and efficiency.

 

Expanding the GaN ecosystem

To support designers who are taking advantage of GaN technology in their power designs, TI is also introducing new products to expand its GaN ecosystem. The LMG5200POLEVM-10, a 48-V to 1-V point-of-load (POL) evaluation module, will include the new TPS53632G GaN FET controller, paired with the 80-V LMG5200 GaN FET power stage. The solution allows for efficiency as high as 92 percent in industrial, telecom and datacom applications.

 

Availability and pricing

TI will offer a development kit that includes a half-bridge daughtercard and four LMG3410 IC samples. A second kit contains a system-level evaluation motherboard. When used together, these two kits enable immediate bench testing and design. The two development kits are available for purchase now in the TI store and are priced at $299.00 and $199.00, respectively.

Liat

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

4 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

4 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

4 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

4 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

4 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

4 days ago