Categories: Electronic Design

Infineon enables new high-performance FPGA development platform

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that its Digital Point-of-Load (PoL) DC-DC regulators with full PMBus capabilities are featured in the Kintex® UltraScale™ development board. A key driver for the design flexibility of the board is the superior PMBus connectivity of the IR3806x family. Configurations can be stored in internal memory. In addition, PMBus commands allow run-time control, fault status and telemetry.

Tremendous flexibility

The on-chip programmable SupIRBuck™ regulator provides tremendous flexibility for FPGA-based design. Thus, it easily adapts to rapidly changing design requirements. The IR3806x SupIRBuck voltage regulator features integrated PWM controller and MOSFETs in a single package. It delivers 90 percent more efficiency for all rails including all losses and less than sub 10 mV peak-to-peak ripple from 3 to 35 A in a tiny footprint. The regulator allows system power management on a high level and is extremely robust.

Despite being compact, the IR3806x family delivers a fully integrated PoL regulator with advanced power management programmability, margining, sequencing, and telemetry across multiple rails via full PMBus 1.2 compatibility. The board includes all functions for an embedded processing system. This enables designers to easily design and verify applications.

The Xilinx Bit Error Test (BERT) demonstrates error losses through rigorous code testing. It uses worst case bit patterns across serial transceiver/receivers. The IR38060 delivers precise power performance: zero bit error test results show no contribution to jitter noise across the pattern.

Infineon will show the Xilinx Kintex UltraScale board in its booth #1917 at the APEC March 20-24, 2016 in Long Beach, California. Further information is available at: www.infineon.com/Xilinx.

Liat

Recent Posts

NVIDIA and AWS Expand Full-Stack Partnership, Providing the Secure, High-Performance Compute Platform Vital for Future Innovation

AWS integrates NVIDIA NVLink Fusion into its custom silicon, including the next-generation Tranium4 chip, Graviton…

2 days ago

Molex Names Top 10 Connectivity and Electronics Design Predictions for 2026, Fueled by Far-Reaching Impact of Artificial Intelligences Across Major Industries

Intensifying AI demands continue to proliferate across aerospace and defense, automotive, consumer electronics, data center,…

2 days ago

Tria Technologies to bring Qualcomm DragonwingTM IQ-6 Series to market with two new compute modules

 TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules enable next-generation edge AI systems across a wide range…

2 days ago

At NeurIPS, NVIDIA Advances Open Model Development for Digital and Physical AI

NVIDIA releases new AI tools for speech, safety and autonomous driving — including NVIDIA DRIVE…

2 days ago

OMRON eases PCB-relay assembly and replacement with P6K surface-mountable sockets

 P6K sockets for G6K through-hole relays ensure reliability, flexibility, and repairability  OMRON Electronic Components Europe…

2 days ago

GEOX.AI and Mitsui Sumitomo Insurance Launch AI-Powered Initiative to Assess Building Risk Across Japan

GEOX.AI, a global leader in AI-driven property intelligence, announced today a strategic partnership with Mitsui…

2 days ago