Supports communications by low-profile Bluetooth Smart applications in a very thin chip-scale package-
TOKYO– Toshiba Corporation’s (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of “TC3567WBG-006”, a new line-up of Bluetooth® Low Energy[1](LE) communication ICs that support Bluetooth Core Version 4.1 for use with Scatternet[2] devices. Sample shipments start today.
Based on Toshiba’s already released “TC35667FTG/FSG-005” for Bluetooth Smart devices, the new IC is configured with new ROM software for Scatternet and multipoint connection, in a very thin chip-scale package, only 2.88mm x 3.04mm x 0.3mm. It will bring Bluetooth Low Energy communication networks to low-profile applications, such as contactless cards, tags and tickets.
The Scatternet standard defines two functions in the Bluetooth Core specification, for Version 4.0 and higher. Compliant devices have to support either multiple or simultaneous connections with Master and Slave devices or multiple connections between two or more Master devices at the same time. Toshiba’s new IC supports both functions with Bluetooth Low Energy, making it easy to create a network with very small devices.
Samples of packaged chips for Scatternet, “TC35667FTG-006/FSG-006”, and of “TC35670FTG-006”, which supports both Bluetooth and NFC tag functionality, also start to ship today.
Toshiba will contribute to the realization and promotion of Scatternet-based communication networks with low-profile applications, and support devices that optimize communication functions required for Internet of Things (IoT) applications, such as auto-monitoring systems and multifunctional applications.
Key Features of the New Product
Bluetooth Smart devices, including connected home products, wearable devices, healthcare devices, smartphone accessories, remote controllers, toys and IoT devices.
| Part Number | TC35667WBG-006 |
|---|---|
| Operating Voltage Range | 1.8V to 3.6V |
| Current Consumption | Lower than 5.9mA (@3.3V, Bluetooth LE operation, -4dBm transmitter operation or receive operation) |
| Current Consumption, Deep Sleep | 50nA typical (@3.3V) |
| Operating Temperature | -40°C to 85 °C |
| Package | WCSP41, 2.88mm x 3.04mm x 0.3mm, 0.4mm pitch |
| Bluetooth Part | |
| Bluetooth Version | Ver. 4.1 Central and peripheral function Scatternet function, multipoint connection |
| Transmitter Output Power | 0dBm to -20dBm (4dB steps) |
| Receiver Sensitivity | -92.5dBm |
| Profiles | GATT (Generic Attribute Profile), including server and client functions |
| Interfaces | UART, I2C, SPI, GPIO |
| Other Features | DC-DC Converter Low drop regulator General purpose ADC User program function Wake up signal for host device PWM function |
Notes:
1. Bluetooth Low Energy: the low power consumption communication technology defined as Bluetooth Ver. 4.0 and higher.
2. Scatternet: A group of independent and non-synchronized piconets (a piconet is formed when at least two Bluetooth-enabled devices connect) that share at least one common Bluetooth device.
* Bluetooth, Bluetooth Low Energy and Bluetooth Smart Ready are registered trademarks owned by the Bluetooth SIG; Toshiba uses them under license.
NVIDIA has announced strategic partnerships with photonics manufacturers Coherent and Lumentum to develop next-generation optical…
Infineon Technologies has introduced the EZ-PD™ PMG1-B2, described as the industry’s first single-port USB Type-C…
Cato Networks Unveils World’s First Auto-Adaptive Threat Prevention Engine in a SASE Platform to Stop…
SCHURTER positions Lucerne as global technology and innovation hub SCHURTER Group has outlined plans to…
Menlo Microsystems, in collaboration with Purdue University, has demonstrated a commercial-ready architecture for quantum control…
Compact board-mount contactor replacement with optimized 1500VDC/25A-make current Hoofddorp, The Netherlands, 4 March 2026 -…