Categories: NEW PRODUCTS

NXP Introduces Industry’s Lowest Power Voltage Translators

Enables engineers with flexibility to design high performance applications with freedom

NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced the AXP family of logic translators, designed for low-power and high-performance applications. The family of AXP translators is the lowest power voltage translator solution in the market while also offering the widest range of voltage translation from 0.7 volts to 5.5 volts. The AXP translators (AXPnT) are ideal for high performance applications with Microprocessors/Microcontrollers/SOCs operating at ultra-low voltages below 1.8 volts that still need to interface with I/O peripheral solutions typically operating at 2.5 V, 3.3 V, or even 5.5 V.

In 2014, NXP introduced the AXP family of logic devices, offering the lowest power logic functions in the industry. With today’s introduction of the AXPnT, NXP now offers solutions to interfacing Microprocessors/Microcontrollers/ASICs operating as low as 0.7 V to peripheral devices operating as high as 5.5 V.

The AXPnT includes standard buffers, as well as gates and configurable functions. They are available in both leaded and leadless package options, including NXP’s 5 and 6pin GX packages. These packages are the smallest leadless logic packages in the industry. By providing the lowest power voltage translator products, NXP Semiconductors continues to support the migration of applications to lower voltages. The result is greater power savings for battery powered applications, while at the same time facilitating the interfacing of lower-voltage ASICs, microprocessors, microcontrollers, or SOC chips with legacy higher-voltage peripheral devices in the market place.

Features of AXPnT devices

  • Dual supply voltage level translation

o    VCCI = 0.7 V to 2.75 V

o    VCCO = 1.2 V to 5.5 V

  • Very low dynamic power dissipation (CPD)
  • Schmitt-trigger action on all inputs
  • 12mA balanced output drive
  • Over-voltage tolerant inputs and outputs
  • Leaded & Leadless Package Options
  • Fully specified (-40 to +85 °C)
  • Pb-free, RoHS compliant and Dark Green

Availability
The AXP translator family of devices are expected to sample in February 2016.

Liat

Recent Posts

Cato Networks Surpasses $415 Million ARR with 42% Annual Growth

Enterprise demand and AI security adoption drive continued global expansion Cato Networks has announced that…

1 day ago

Kaltura Showcases AI-Powered Live Sports Platform Following Record 2026 FIFA World Cup Streaming

The Nasdaq-listed company says its platform handled more than 1.3 billion playback sessions during the…

1 day ago

Cadence Launches AuraStack, Bringing Agentic AI to PCB and Advanced Packaging Design

Cadence has introduced AuraStack, a new Agentic AI platform designed to automate and orchestrate the…

1 day ago

Five Semiconductor Trends Defining the Next Generation of Computing

Artificial intelligence, advanced manufacturing, high-bandwidth memory and new packaging technologies are reshaping the semiconductor industry.…

2 days ago

Microchip Technology Signs Definitive Agreement to Acquire Hailo

Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today…

2 days ago

Mobileye Enters a New Chapter as Founder Amnon Shashua Steps Down as CEO, Raises Outlook and Expands Stellantis Partnership

Mobileye is entering one of the most significant periods in its history. Alongside stronger-than-expected second-quarter…

2 days ago