STMicroelectronics to Showcase its Latest Smart-Driving Solutions at the 8th International Automotive Electronics Technology Expo

In ADAS, ST will demonstrate a vehicle-to-vehicle and vehicle-to-infrastructure (V2X) communication chipset co-developed with the Israeli company Autotalks. Integrating a baseband, a host microcontroller unit (MCU), and a secure MCU, the chipset employs V2X communication technologies that leverage GPS data and Wi-Fi (801.11p), contributing to the creation of automated-driving solutions for analyzing nearby vehicles and road conditions. The V2X chipset complements ST’s positioning IC, which supports all major Global Navigation Satellite Systems (GNSS). ST will also introduce an in-car CMOS camera module with a high dynamic range and best-in-class signal-to-noise ratio in low-light conditions, targeting vision-based systems that detect pedestrians, obstacles, road signs, and traffic lanes.

In anticipation of a future where vehicles become connected to the Internet and mobile devices, ST offers secure MCUs for Automotive that comply with the Trusted Platform Module (TPM) 2.0 security specification, achieving the maximum level of security in the physical layer. At CAR-ELE 2016, ST will also show how in-car devices connect to a smartphone using an NFC device, and a network processor that complies with the automotive-grade Bluetooth^® Low Energy specification.

Today, automobiles contain a multitude of sensors that collect information about the vehicle enabling advanced safety features. A major supplier of in-car MEMS (micro-electro-mechanical system) technologies, ST will demonstrate various in-car MEMS sensors at the show, including a three-axis acceleration sensor for a car emergency notification system and one/two-axis acceleration sensors for airbags. ST will also demonstrate the combination of a six-axis sensor module (a three-axis acceleration sensor coupled with a three-axis gyro sensor) and positioning ICs for dead-reckoning-navigation features in locations where GNSS data is not available.

ST will display its complete portfolio of Automotive MCUs for in-car applications. ST’s Power Architecture™-based 32-bit MCUs are ideal for high-reliability control applications, including engine control, transmission, anti-lock braking systems, electrically operated power steering, active suspension, and ADAS. As recently announced, ST has also licensed new 32-bit ARMv8-R processor technology to expand its portfolio of Automotive MCU solutions targeting real-time safety-related Smart Driving applications.

Other ST products shown at CAR-ELE 2016 include an IGBT that uses trench-field-stop technology and a Power MOSFET that supports a wide range of breakdown voltages (40V to 1500V). These products are suited for the DC-DC convertor or invertor inside the Power control unit (PCU) of electric/hybrid cars, reducing electrical power loss and heat generation to improve the energy efficiency of the vehicle. Also on display at the ST booth are transmission-control ICs, intelligent high-side drivers, distance-measurement sensors, EEPROMs, protective devices for in-car Ethernet, and motor drives.