Categories: NEW PRODUCTS

TE Connectivity EVC 250 main contactor meets demanding switching requirements in hybrid, electric and fuel cell vehicles – now available in Europe through TTI

Safe, space-saving design with larger contact gaps and optimsed switching dynamics, continuous  DC current up to 250A; meets IEC 60664

Now available in Europe at TTI, Inc., a world leading specialist distributor of electronic components, TE Connectivity’s EVC 250 Main Contactor is specifically designed to meet the demanding switching requirements of hybrid, full-electric and fuel cell vehicles, as well as in-vehicle charging systems.  The EVC 250 contactor works without a pressurized contact chamber and features larger contact gaps and optimized switching dynamics. It achieves maximum performance with continuous DC current ratings of 250A at 85degC, which ensures a safe short-circuit carry capability of 6000A. With no pressurized contact chamber, the new EVC 250 main contactor offers a longer operating life than comparable systems, as service replacement due to pressure loss or gas leaking is no longer necessary.

The TE Connectivity EVC 250 Main Contactor has a space-saving design – its physical dimensions are only 93mm x 55.3mm x 49.8mm and it weighs 560g. Design flexibility  is further supported by a voltage rating of up to 450VDC. Ambient temperature range is minus 40degC to +85degC and the device is dustproof to IP54 (IEC 60529).  Its simplified construction supports fully automated production. The device fulfils the installation requirements of IEC 60664.

The TE Connectivity EVC 250 Main Contactor is available now in Europe at TTI, packaged in units of 24.

Liat

Recent Posts

Cato Networks Surpasses $415 Million ARR with 42% Annual Growth

Enterprise demand and AI security adoption drive continued global expansion Cato Networks has announced that…

2 days ago

Kaltura Showcases AI-Powered Live Sports Platform Following Record 2026 FIFA World Cup Streaming

The Nasdaq-listed company says its platform handled more than 1.3 billion playback sessions during the…

2 days ago

Cadence Launches AuraStack, Bringing Agentic AI to PCB and Advanced Packaging Design

Cadence has introduced AuraStack, a new Agentic AI platform designed to automate and orchestrate the…

2 days ago

Five Semiconductor Trends Defining the Next Generation of Computing

Artificial intelligence, advanced manufacturing, high-bandwidth memory and new packaging technologies are reshaping the semiconductor industry.…

3 days ago

Microchip Technology Signs Definitive Agreement to Acquire Hailo

Microchip Technology Incorporated, a leading provider of smart, connected, and secure embedded control solutions, today…

3 days ago

Mobileye Enters a New Chapter as Founder Amnon Shashua Steps Down as CEO, Raises Outlook and Expands Stellantis Partnership

Mobileye is entering one of the most significant periods in its history. Alongside stronger-than-expected second-quarter…

3 days ago