Categories: NEW PRODUCTS

Lowest Power RS-485 Transceiver from Exar Includes Low Voltage Interface and Features <3uA Standby Current

Fremont, CA – December 1, 2015 – Exar Corporation (NYSE: EXAR), a leading supplier of analog mixed-signal products serving the industrial, high-end consumer and infrastructure markets, announces the XR33202, a half-duplex, 20Mbps RS-485 (TIA/EIA-485) transceiver optimized to operate over a wide 3V to 5.5V supply voltage range.  The transceiver includes an adjustable low voltage logic interface and features the industry’s lowest standby current of 3uA (max), 0.05uA (typ). The device’s wide operating voltage range, flexible logic interface, and low standby current make it ideal for battery-powered and multi-voltage systems.

“The adjustable low voltage interface included in the XR33202 simplifies integration of the transceiver in low voltage and multi-voltage systems,” said Dale Wedel, Exar’s vice president, high performance analog products.

The XR33202 exceeds the highest ESD rating of IEC 61000-4-2 Level 4. It also includes protection features such as hot swap glitch, overload and enhanced receiver fail-safe for open, shorted or terminated idle data lines.
Specified over an extended temperature range of -40oC to 125oC, the XR33202 is offered in RoHS compliant, green/halogen free, space-saving 3mm x 3mm DFN package. 1,000-piece pricing starts at $1.60 each. For more information, visit www.exar.com/XR33202. Additional information on other serial transceiver products is available at www.exar.com/connectivity/transceiver.

Summary of features:

  • Wide 3.0V to 5.5V supply operation
  • 65V to 5.5V I/O logic interface VL pin
  • <3uA (max) standby current
  • 20Mbps maximum data rate
  • Robust ESD (Electrostatic Discharge) protection for RS-485 bus pins
  • -40°C to 125°C ambient operating temperature range
Liat

Recent Posts

Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets

Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging…

1 day ago

NVIDIA Acquires Open-Source Workload Management Provider SchedMD

NVIDIA will continue to distribute SchedMD’s open-source, vendor-neutral Slurm software, ensuring wide availability for high-performance…

1 day ago

Stratasys Supercharges Airbus Production: More Than 25,000 Parts 3D-Printed this Year; 200,000+ Already in Flight

Powered by Stratasys (NASDAQ: SSYS) technology, Airbus is producing more than 25,000 flight-ready 3D-printed parts…

3 days ago

Quantum Art Raises $100 Million in Series A Round to Drive Scalable, Multi-Core Quantum Computing

Funding will support Quantum Art in reaching a 1,000-qubit commercial platform and global expansion Quantum…

6 days ago

Hud Ships First Runtime Code Sensor to Bring Production Reality to Code Generation

Hud automatically captures live service and function-level data from production- providing the missing context for…

6 days ago

Port Raises $100M Series C to Power Agentic Engineering Platform

General Atlantic leads round valuing company at $800M as Port tackles the 90% of developer…

6 days ago