Components

Vicor to present how to accelerate xEV design using 48V at Automotive HV Power Supply Systems Conference in Munich

Vicor, the high-performance power module company, will showcase its expertise in 48V on June 26-29 delivering two sessions at the…

3 years ago

Intel’s New Chip to Advance Silicon Spin Qubit Research for Quantum Computing

Today, Intel announced the release of its newest quantum research chip, Tunnel Falls, a 12-qubit silicon chip, and it is…

3 years ago

Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility

Infineon presents its new generation of 1200 V CoolSiC™ MOSFETs in TO263-7 for automotive applications. The automotive-graded silicon carbide (SiC)…

3 years ago

New Cesium Atomic Clock Provides Autonomous Precise Time of 100 ns Holdover for Months

Microchip’s 5071B is a compact commercial timing product offering ease of deployment across multiple industries CHANDLER, Ariz., June 12, 2023…

3 years ago

u-blox announces two new high-precision GNSS positioning modules based on the successful F9 platform

The NEO-F9P enables precise navigation and automation of moving industrial machinery, while the ZED-F9P-15B offers customers in the mobile robotics…

3 years ago

Infineon’s HYPERRAM™ 3.0 memory and Autotalks’ 3rd generation chipset drive next-generation automotive V2X applications

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Autotalks announced today that the two companies are collaborating to deliver…

3 years ago

Renesas Expands Market-Leading Motor Control Embedded Processing Portfolio with Over 35 New MCUs

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today debuted three new MCU groups targeting motor control…

3 years ago

Infineon launches SLC26P security controller based on 28 nm technology for payment applications; expands its supply option to enable long-term, dependable sourcing for smart card and embedded security ICs

Commercial production of integrated circuits using 28 nm technology node began several years ago. As the process technology has matured,…

3 years ago

Achieve maximum design flexibility with Molex Mirror Mezz Connectors

Footprint-compatible Hermaphroditic Mirror Mezz connector lowers application costs with stackable mating to support data speeds up to 56 Gbps per…

3 years ago

Infineon launches XENSIV™ connected sensor kit, a new IoT sensors platform

IoT ecosystems and connected devices enable new service offerings and peripheral services to be bought and unlocked. However, prototyping sensor-based…

3 years ago