Components

Renesas Electronics Launches RX23E-A Group, First RX Microcontrollers Built-In Industry-Leading Analog Front End For High-Precision Sensing and Measurement Equipment

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the RX23E-A Group 32-bit RX microcontrollers…

7 years ago

Renesas Launches RX72T Group to Expand Microcontroller Options for Servo Control in Industrial Robots

Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RX72T Group of 32-bit motor control…

7 years ago

u-blox takes continuous lane accurate positioning to challenging urban environments

u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies, has announced the u‑blox ZED-F9K high precision multi-band…

7 years ago

Maxim Unveils Smallest, Most Power-Efficient Dual IO-Link Transceiver with DC-DC Regulator and Surge Protection

Designers can now enable smarter digital factories with the MAX22513 surge-protected, dual-driver IO-Link® device transceiver with integrated DC-DC buck regulator from…

7 years ago

Toshiba’s new small surface mount LDO regulators lower power consumption

Toshiba Electronics Europe GmbH has launched two new series of small surface mount LDO regulators for application in the power…

7 years ago

Samsung Develops Industry’s First 3rd-generation 10nm-Class DRAM for Premium Memory Applications

New 8Gb DDR4 based on most advanced 1z-nm process enables DRAM solutions with ultra-high performance and power efficiency The 1z-nm…

7 years ago

ON Semiconductor Introduces New Industrial and Automotive Qualified SiC MOSFETs Complementing a Growing Ecosystem and Bringing Wide Band Gap Performance Benefits to Rapid Growth Applications

ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has introduced two new silicon carbide (SiC) MOSFET devices. The industrial grade…

7 years ago

Samsung Launches Highest-capacity Mobile DRAM to Accommodate Next-generation Smartphones

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the highest-capacity mobile…

8 years ago

REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution for high quality photo effects and more

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is presenting the fourth generation of its REAL3™ image sensor IRS2771C at…

8 years ago

Industry’s first automotive USB 3.1 SmartHub with Type-C™ support enables 10x faster data rates in infotainment systems

Microchip announces an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB…

8 years ago