NEW PRODUCTS

Rugged Nicomatic EMM Series rectangular connectors resist high vibration and shock to enable miniaturization in harshest-environment applications

Meets or exceeds MIL 83513-G and MIL-DTL 55302G; resists fluid immersion, salt spray; temperatures to +150C; multiple different configurations May…

5 years ago

Bluetooth 5.1 module enables mesh networking for ‘massive IoT’ applications

u-blox NINA-B4 modules use Nordic nRF52833 SoC-enabled Wirepas software for large-scale network deployments Thalwil, Switzerland – May 18, 2021 –…

5 years ago

Anritsu and HEAD acoustics extend their cooperation to support Solution for 5G VoNR Voice Quality Evaluation

Vienna, Austria, May 17, 2021 - Anritsu Corporation is pleased to announce a new efficient solution integrated with a hardware…

5 years ago

Synopsys ZeBu Server 4 Adopted by Xsight Labs for Intelligent Networking Switch Processor

ZeBu’s 7 Billion Gate Cloud Capacity Enabled Full Chip Debug for Complex Networking SoC Validation MOUNTAIN VIEW, Calif., May 10,…

5 years ago

New i.MX8M Mini solder-down SoM from Direct Insight combines high performance, miniaturization and low cost

Low power, multi-featured module enables PCIe access Oxfordshire, UK May 2021: Direct Insight, the UK-based, technical systems integrator and reseller…

5 years ago

Infineon launches industry’s highest density QML-V-certified QDR-II+ SRAM to simplify on-system satellite image processing

Munich, Germany – 10 May 2021 – Infineon Technologies LLC, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company,…

5 years ago

2300 V isolated EiceDRIVER™ 2L-SRC Compact: Optimizing system efficiency and EMI in the most compact form factor

Highest efficiency is a key requirement for today’s power electronics. Therefore, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces…

5 years ago

Renesas RX MCU Becomes World’s First General-Purpose MCU to Obtain CMVP Level 3 Certification Under NIST FIPS 140-2 Security Standard

By Using Certified RX MCUs, Customers Can Easily Develop Devices Meeting Security Requirements RX MCU Obtains CMVP Level 3 Certification…

5 years ago

New Harwin Multi-Directional Spring Contacts Address Situations Where Board Connection Flexibility is Needed

Latest additions present a compact method for implementing both horizontal and vertical connections Always providing highly inventive engineering solutions, Harwin…

5 years ago

New cell technology for Neue Klasse: BMW Group strengthens battery expertise as part of the European Battery Innovation initiative.

Munich. The BMW Group is accelerating its development for the battery technology of the future, thereby supporting the ramp-up of a…

5 years ago