Stack-on-Board RN2483 Named Golden-Unit Reference Module for All Future Certifications; Makes it Easy to Tap the Long Range and Low Power…
Audi’s Third Combined Digital Instrument Cluster and Multi Media Interface to Employ Microchip’s MOST150 INICs With USB for Seamless Connection…
Honeywell (NYSE: HON), a leader in managing home comfort and security, is announcing a new Channel on IFTTT – the…
Delphi Automotive PLC (NYSE: DLPH) has acquired the HellermannTyton Group PLC, a leading global manufacturer of high-performance and innovative cable…
TDK Corporation ("TDK") announces an all cash public tender offer for all publicly held registered shares of Micronas Semiconductor Holding…
TowerJazz to Provide Process Engineering and Equipment Maintenance and Support at Revenue of approximately $35 Million TowerJazz, the global specialty…
Swisscom has signed a new, intensified network partnership agreement with Ericsson (NASDAQ: ERIC). Swisscom and Ericsson will form a joint…
ST to offer complete line of solutions including LoRa systems on chips (SOCs) to accelerate deployments of low-power wide-area networks by…
Internet of Things integrated circuit sales expected to display a CAGR of 15.9% over the next four years, with MCUs…
Duesseldorf, Germany, December 16, 2015 – Huawei announced that the total sales order value of the Consumer Business Group (CBG)…