LATEST NEWS

European Premiere: HARMAN’s Connected Car Compute Platform for Advanced, Holistic Vehicle Intelligence on Display at the Geneva International Motor Show 2016

HARMAN simplifies system integration for more powerful, flexible and intelligent vehicles. Life-Enhancing Intelligent Vehicle Solution (LIVS) in Rinspeed ΣTOS concept…

11 years ago

Taiwan Passes South Korea to Become #1 in Total IC Wafer Fab Capacity

China now has over 50% more IC wafer fabrication capacity than Europe. IC Insights recently released its new Global Wafer…

11 years ago

ams announces seasoned semiconductor executive Alexander Everke as CEO

Former CEO Kirk Laney continues as ams’ Chief Strategist for Sensors and remains a member of the Management Board Premstaetten,…

11 years ago

Infineon and Partners Demonstrate IoT Security at RSA Conference 2016

Increasingly important for the success of IoT (Internet of Things) development are the ease-of-use in system design and implementation paired…

11 years ago

HARMAN and NXP Cooperate on Secure Vehicle-to-X Communication

At the Geneva International Motor Show, HARMAN and NXP showcase communications technology that saves thousands of lives and improves traffic…

11 years ago

Cable TV provider UPC Poland selects Ericsson for field maintenance managed services and transformation

Ericsson to assume responsibility for field maintenance, network quality and operational efficiency in UPC Poland's network Deal represents Ericsson's first…

11 years ago

UK AND GSMA PARTNER ON MOBILE TECHNOLOGY TO FIGHT GLOBAL POVERTY

London and Barcelona – Innovative mobile technology will provide life-enhancing services to millions of people in poverty as part of…

11 years ago

VTT and Aalto University to develop new technology for optical data transfer for the evolving needs of the information society

VTT Technical Research Centre of Finland and Aalto University, together with a group of contributing local companies, are starting a…

11 years ago

Drone to help refuse-collecting robot find refuse bins

Students from three universities have collaborated with the Volvo Group and the waste recycling company, Renova. The result is a…

11 years ago

SII Semiconductor Corporation Releases New Automotive EDLC protection ICs suitable for cell-balancing and overcharge protection of EDLC

SII Semiconductor Corporation, a subsidiary of Seiko Instruments Inc. that manufactures semiconductor products, announces the release of the S-19190 Series…

11 years ago