Paris, France - On the occasion of the inauguration of the ETOILE building on the Telecom SudParis campus by French…
Enables faster time-to-market for customer designs UltraSoC today announced that Imagination Technologies (IMG.L) has licensed the full range of UltraSoC…
Enfucell Oy and Molex, LLC have signed a worldwide, non-exclusive manufacturing license agreement for printing Enfucell’s SoftBattery® power sources. Enfucell…
EPFL researchers have printed nanometric-scale sensors capable of improving the performance of atomic force microscopes. Tiny sensors made through nanoscale…
Europe's first test area for UAV-based traffic management opens at Twente Airport in the Netherlands Nokia signs collaboration agreement to…
Through Icomera's Wi-Fi connectivity solutions and Ericsson's managed services, Deutsche Bahn (DB) passengers can now enjoy excellent connectivity while travelling…
The Switch, a Yaskawa company, to acquire Wärtsilä Drives’ products, R&D and manufacturing to strengthen its core advanced electrical drive…
Since yesterday, the merger between research centers imec and iMinds – announced on February 19 – has been completed. The…
IC Insights recently released its September Update to the 2016 McClean Report. This Update included Part 2 of an extensive analysis of the IC foundry…
TactoTek, a leading manufacturer of 3D injection molded structural electronics (IMSE) solutions today announced that it has received a United…