LATEST NEWS

ROHM Semiconductor at SPS 2016: Arduino Shield for Easier and Faster Stepper Motor Driver Designs

At SPS in Nuremberg from November 22-24, 2016, ROHM Semiconductor presents its new Arduino-based evaluation kit (EVK) to support the…

9 years ago

ALTAIR SEMICONDUCTOR OPENS IOT INNOVATION R&D CENTER IN FINLAND

Leading Chipset Maker and IoT Driver Expands Global Operations with First European Research & Development Facility HOD HASHARON, Israel –…

9 years ago

Siemens celebrates 200th birthday of company founder Werner von Siemens

German Chancellor Merkel to attend ceremony in Berlin on November 29 About 100 guests from government, business, science, culture and…

9 years ago

Codasip and UltraSoC deliver advanced RISC-V SoC analysis and debug

Codasip, the leading RISC-V processor IP provider, and UltraSoC, the leading provider of semiconductor IP for on-chip analytics, performance optimization…

9 years ago

Microsemi Leverages 50 Years of Expertise With Launch of Cost-Effective, High Performance Plastic Packaged PIN Diode Control Devices

Company’s New Product Families Continue Legacy of Supplying Premier PIN Diode Products for Challenging RF Power, Small Signal Switching and…

9 years ago

ROHM Semiconductor awards Future Electronics as Distributor of the Year

Future Electronics has been awarded EMEA Distributor of the Year by ROHM Semiconductor during electronica 2016 in Munich. The award…

9 years ago

MACOM Announces Definitive Agreement to Acquire AppliedMicro

MACOM Technology Solutions Holdings, Inc.  (NASDAQ: MTSI) (“MACOM”), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor…

9 years ago

Infineon complements iMOTION™ Modular Application Design Kit with two power boards

Munich, Germany – November 22, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX) adds two power boards to the…

9 years ago

Maxim’s DeepCover® Secure Microcontroller Simplifies EMV Contactless Payment Terminals

MAX32560 integrates security features and payment interfaces to meet latest PCI-PTS standards and reduce development time MUNICH, Germany, and CANNES,…

9 years ago

Leti Announces H2020 Project to Develop Si-photonics-based Transceivers for Low-cost, High-speed Data Communications

COSMICC, Horizon 2020 Project, Combines CMOS Electronics and Silicon Photonics With Innovative High-throughput, Fiber-attachment Techniques To Reach beyond 1 Tb/s…

9 years ago