LATEST NEWS

Mobile ID turns smartphone into connected ID card

Munich, Germany – 24 February 2017 – Notify the council of your new address, pick up your rental car, car…

10 years ago

ARM invests in the future of IoT connectivity

ARM wireless business general manager Paul Williamson talks about the acquisition of Mistbase and NextG-Com to bring industry-leading NB-IoT compliant…

10 years ago

The Future of VR is Here: Qualcomm and Leap Motion Work Together To Demonstrate Natural Interaction for Mobile VR

Utilizing Qualcomm Technologies’ position tracking and Leap Motion’s embedded hand tracking technology, people can now interact with mobile VR content…

10 years ago

CEVA Introduces the World’s Most Advanced Communication DSP, Providing Cutting-Edge Performance for Multi-Gigabit Class Connectivity

CEVA-XC12 is the industry's first DSP capable of meeting the extreme performance requirements critical to the success of 5G, gigabit…

10 years ago

ON Semiconductor Sampling Industry’s Lowest Power Bluetooth® Low Energy SoC for IoT and Connected Health & Wellness

Highly flexible Bluetooth 5 certified Radio System-on-Chip (SoC) provides faster data rates & greater functionality while maximizing system battery life…

10 years ago

UCSD and TowerJazz Demonstrate Best in Class 5G Mobile Transmit-Receive Chips with Greater than 12 Gbps Data Rates

TowerJazz, the global specialty foundry leader, and The University of California, San Diego (UCSD), a recognized leader for microwave, millimeter-wave,…

10 years ago

New research shows perception of STEM subjects is improving

Combined efforts by teachers, industry, engineering organisations and the Government to change the perception of science, technology, engineering and maths…

10 years ago

NI Announces the Next Generation of USRP RIO Software Defined Radio Solutions for Design, Prototyping and Deployment

the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, today announced the…

10 years ago

DuPont Electronics & Communications and Holst Centre Extend Collaboration On Printed Electronics Research and Application Development

BRISTOL, UK and EINDHOVEN, Netherlands, Feb. 23, 2017 – DuPont Electronics & Communications (DuPont) and Holst Centre today announced the…

10 years ago

Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity

IC Insights recently released its new Global Wafer Capacity 2017-2021 report that provides in-depth detail, analyses, and forecasts for IC…

10 years ago