LATEST NEWS

Imec demonstrates 896Gb/s silicon photonics transceiver

At this week’s OFC 2017, the largest global conference and exposition for optical communications, imec, the world-leading research and innovation…

9 years ago

Leading European pilot facilities for industrial biotechnology join forces to improve Europe’s innovation capacity

SmartPilots, an INTERREG Europe project co-funded by  the European Fund for Regional Development (ERDF), brings together six leading European Shared…

9 years ago

REMUS become Official Technology Partner of Mercedes-AMG Motorsport DTM Team

Mercedes-AMG Motorsport DTM Team to benefit from REMUS’s 25 years of racing experience The team will work together with REMUS…

9 years ago

DLR inaugurates the world’s largest artificial Sun Sun at the push of a button

The world's largest artificial Sun started shining in Jülich on 23 March 2017. Johannes Remmel, the North Rhine-Westphalia Minister for…

9 years ago

Samsung Joins Esteemed Watch Community at Baselworld 2017

Samsung Electronics is honored to join the mecca of watch enthusiasts at Baselworld 2017, bridging the gap between high technology…

9 years ago

Epson to Launch Low-TCO SCARA Robots

Seiko Epson Corporation (TSE: 6724, "Epson") is expanding its lineup of industrial SCARA (selective compliance assembly robot arm) robots with…

9 years ago

Leti presented advances in propagation modeling and antenna design at EuCAP in Paris

Paper Is One of 15 that Leti Presented at European Conference on Antennas and Propagation March 19-24 Leti, a research institute…

9 years ago

Toward printable, sensor-laden “skin” for robots

New 3-D-printed device mimics the goldbug beetle, which changes color when prodded. In this age of smartphones and tablet computers,…

9 years ago

Microsoft announces patent license agreement with Toyota, enhancing connected car experience for consumers

Microsoft Corp. on Wednesday announced a new patent licensing agreement with Toyota Corp. that includes broad coverage for connected car…

9 years ago

Samsung and eSilicon Taped Out 14nm Network Processor with Rambus 28G SerDes Solution

Samsung Electronics, a world leader in advanced semiconductor technology, today announced a successful network processor tape-out based on Samsung’s 14LPP…

9 years ago