LG’s Vehicle Components Business Sees Big Growth Ahead in Automotive AI SEOUL, June 29, 2017 — LG Electronics (LG) has…
DANVILLE, CA – June 29, 2017 – ON Semiconductor (NASDAQ:ON) and PowerSphyr Inc. today announced an agreement to develop and…
OTTAWA, Ontario, June 29, 2017 /PRNewswire/ -- Honeywell's (NYSE: HON) advanced Connected Aircraft satellite communications products and services are connecting a…
Two leading European research institutes today announced their new collaboration to develop innovative, next-generation microelectronics technologies to spur innovation in…
Picosun’s ALD solutions enable novel high-speed memories - Picosun Picosun Oy, leading supplier of high quality Atomic Layer Deposition (ALD)…
TOKYO—Toshiba Corporation and Toshiba Memory Corporation today filed a petition with the Tokyo District Court against Western Digital Corporation, a…
Waldenburg/Germany, Lanskroun/Czech Republic, 29 June 2017 – Würth Elektronik eiSos is pleased to announce its cooperation with and support for…
Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow…
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its image sensor brand ‘ISOCELL®’ as well as demonstrated…
Intel has delivered the world’s first commercially available 64-layer, TLC, 3D NAND solid state drive (SSD). While others have been…