Siemens AG ("Siemens") and The AES Corporation (NYSE: AES, "AES") announced today their agreement to form a new global energy…
SANTA CLARA, Calif., July 11, 2017 – Intel today launched its new Intel® Xeon® Scalable processors, providing businesses with breakthrough performance to…
For decades, computer chips have increased efficiency by using “caches,” small, local memory banks that store frequently used data and…
Following many years of joint development, the Federal Office of Bundeswehr Equipment, Information Technology and In-Service Support (BAAINBw) has signed…
Nano Dimension Ltd., a leader in the field of 3D printed electronics (NASDAQ, TASE: NNDM), announced today that its wholly…
University of Washington researchers have invented a cellphone that requires no batteries — a major leap forward in moving beyond chargers, cords…
To address the substantial opportunities in urbanization and industrialization that are rapidly arising in Asia, Siemens will be setting up…
At its annual Imec Technology Forum USA in San Francisco, imec, the world-leading research and innovation hub in nano-electronics and…
Today, TactoTek announced the opening of its new manufacturing and corporate headquarters facilities in Oulu, Finland, initiating a new phase…
As climate change accelerates, IBM (NYSE: IBM) is galvanizing the global science community with a massive infusion of computing resources, weather…