LATEST NEWS

Teledyne e2v welcome Lord Callanan and senior representatives of the Space Industry to discuss the pending UK Space Industry Bill

Lord Callanan, Minister for Aviation and lead minister in the House of Lords for the Space Industry Bill, along with…

9 years ago

LG AND QUALCOMM TO JOINTLY RESEARCH AND DEVELOP NEXT-GEN CONNECTIVTY SOLUTIONS FOR CARS

SEOUL, Oct. 19, 2017 — LG Electronics (LG) announced that it is teaming up with Qualcomm to jointly develop a…

9 years ago

Samsung Completes Qualification of 8nm LPP Process

8nm LPP is now ready for production, targeting high performance applications Samsung Electronics, a world leader in advanced semiconductor technology,…

9 years ago

Verizon, Qualcomm and Novatel Wireless Announce Collaboration to Expedite Trials and Wide-scale Commercial Deployment of 5G NR mmWave Technology

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and Novatel Wireless, an Inseego company, announced plans to collaborate…

9 years ago

Stella Vie wins World Solar Challenge 2017

Solar Team Eindhoven has won the 2017 World Solar Challenge Cruiser Class Division in their Stella Vie solar car, with…

9 years ago

New Nokia FTTx solutions give operators greater flexibility and choice to meet ultra-broadband demand

Nokia expands micro-node portfolio to support new deployment models for next generation PON, G.fast- and VDSL2-based services. New solutions drive…

9 years ago

Intel and Mobileye Offer Formula to Prove Safety of Autonomous Vehicles

Speaking today at the World Knowledge Forum in Seoul, South Korea, professor Amnon Shashua, Mobileye CEO and Intel senior vice…

9 years ago

Siemens showcases digitalization applications for machine and plant builders

Extended Digital Enterprise portfolio for discrete and process industries Machine and plant builders use digitalization to develop new business models…

9 years ago

NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module

Company’s new MOB10 contactless chip module transforms how passports and identity cards are designed while adding more security layers and…

9 years ago

Qualcomm Technologies Extends RF Front End Portfolio to Deliver Modem-to-Antenna Solution for 600 MHz Bands

Announces Its First Band 71 Optimized PA Module, Adaptive Aperture Tuner and Filters Qualcomm Technologies, Inc., a subsidiary of Qualcomm…

9 years ago