KEMET, a leading global supplier of electronic components, today announced new patented KONNEKT technology enabling high power density by combining multiple components…
Ficosa, a top-tier global provider devoted to the research, development, manufacturing and marketing of high-technology vision, safety, connectivity and efficiency…
The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today…
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity…
Ericsson (NASDAQ:ERIC) has signed a contract with Pakistan Mobile Communications Ltd (Jazz) in Pakistan for the optimization and performance management…
In the future, the supplier of technology and services Bosch and the reinsurance company Munich Re will be collaborating to…
Bluetooth Low Energy (LE) has emerged as a major transmission technology for the Internet of Things (IoT). Bluetooth LE components…
S3 Semiconductors, a global supplier of Mixed-Signal and RF Application Specific Integrated Circuit (ASIC) solutions, is pleased to announce that…
Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the new Qualcomm® Snapdragon™ 700 Mobile Platform Series, designed…
AMARO (Italy), February 28, 2018 – AAEON Technology Europe BV to launch a partnership with Eurotech to integrate ESF (Everyware…