LATEST NEWS

Premier Farnell Signs Contract for State-of-the-art Order Fulfilment Solution for New Leeds Distribution Centre

Premier Farnell, the Development Distributor, has signed a contract with SSI Schaefer, one of the global market leaders and innovators…

8 years ago

Harwin Expands Breadth of Robust Surface Mount 3-Point PCB Socket Series

High-reliability connector supplier Harwin has announced further additions to its Sycamore Contact product offering. While this series was initially capable…

8 years ago

NXP and Smart Columbus Continue to Partner on the Future of Smart Mobility

NXP Semiconductors N.V.(NASDAQ:NXPI), has announced the next phase in its Smart City collaboration with Columbus, Ohio, the winner of the…

8 years ago

Baidu to Integrate Mobileye’s Responsibility Sensitive Safety Model into Apollo Program

Baidu announced that it plans to work with Mobileye to integrate and commercially deploy Mobileye’s Responsibility Sensitive Safety (RSS) model in both…

8 years ago

LETI DEMONSTRATES NEW WAVEFORM FOR 5G LOW-POWER WIDE-AREA INTERNET OF THINGS NETWORKS

 Leti, a research institute of CEA Tech, today announced that field trials of its new Low Power Wide Area (LPWA)…

8 years ago

Kerlink Partners with SPHINX to Bring Internet of Things Solutions to More Network Integrators & Resellers in Europe

Thorigné-Fouillard and Montaigu, France – June 29, 2018, 8:00am. CET – Kerlink (ALKLK - FR0013156007), a specialist and global leader in solutions dedicated to…

8 years ago

Hyundai Motor Company Partners with Autotalks to Develop Connectivity Technology for Increased Road Safety

Hyundai Motor announced today its strategic partnership with Autotalks, a leading technology company specialized in the manufacturing of Vehicle to…

8 years ago

Avnet Abacus honoured with Senten Manten Gold Award by TDK

Outstanding sales performance, strong leadership, and technical excellence are highlighted in annual distribution awards Poing, Germany, 3rd July, 2018: Avnet…

8 years ago

Ericsson and MediaTek collaborate to accelerate and expand NB-IoT device ecosystem

At the Ericsson booth at Mobile World Congress Shanghai, Ericsson and MediaTek demonstrated end to end integration of NB-IoT use…

8 years ago

At ISC 2018, Intel Transforms the Future of High-Performance Computing

What’s New: A new era of supercomputing offers unprecedented opportunities for scientific and industrial breakthroughs. The global competition among high-performance computing…

8 years ago