LATEST NEWS

Tria to launch five new product families powered by Qualcomm at Embedded World

  Tria™ creates embedded modules using Qualcomm Technologies, Inc. Stutensee, Germany – March 4, 2025 –Tria Technologies, an Avnet company specializing…

1 year ago

IBM Expands Granite Model Family with New Multi-Modal and Reasoning AI Built for the Enterprise

ARMONK, N.Y., Feb. 26, 2025 /PRNewswire/ -- IBM (NYSE: IBM) today debuted the next generation of its Granite large language model (LLM) family, Granite…

1 year ago

IBM Completes Acquisition of HashiCorp, Creates Comprehensive, End-to-End Hybrid Cloud Platform

RMONK, N.Y., Feb. 27, 2025 /PRNewswire/ -- IBM (NYSE: IBM) today announced it has completed its acquisition of HashiCorp, whose products automate and secure the infrastructure…

1 year ago

Melexis illuminates the future of automotive lighting with MeLiBu® 2.0

Tessenderlo, Belgium 13 March 2025 – Melexis is pleased to unveil the MLX80142 two RGB LED driver (six channels), the…

1 year ago

eInfochips joins Samsung Advanced Foundry Ecosystem (SAFE™) to Drive Semiconductor Innovation

San Jose, Cali., and Ahmedabad, India - February 27, 2025 – eInfochips, an Arrow Electronics company, announced the company has…

1 year ago

Infineon presents innovative microcontroller solutions supporting high-quality designs at embedded world 2025

Munich, Germany – 27 February 2025 – Devices and systems – from automotive and industrial to consumer electronics – rely…

1 year ago

DigiKey and Qorvo® Announce Global Distribution Agreement

THIEF RIVER FALLS, Minnesota, USA - DigiKey, a leading global commerce distributor offering the largest selection of technical components and…

1 year ago

Cisco Expands Partnership with NVIDIA to Accelerate AI Adoption in the Enterprise

Bringing together two of the most utilized networking portfolios, Cisco Silicon One and NVIDIA Spectrum-X, will offer enterprises unmatched flexibility…

1 year ago

Danisense expands rapid prototyping capabilities with advanced winding machines to accelerate R&D innovation

 Key points: Danisense expands rapid prototyping capabilities with integration of advanced winding machines Highly customized coil configurations can now be…

1 year ago

Intel Xeon 6 with E-Cores Achieves Breakthrough in Power Efficiency and Ecosystem Adoption

Intel has announced a major milestone in power efficiency and ecosystem adoption for its Intel Xeon 6 processors with Efficient-cores…

1 year ago