Today, the microcontroller company Hyperstone announces the addition of John Carey to strengthen the American team as Vice President of…
Boeing NeXt program tests prototype to advance safety and technology of urban air mobility Electric vertical takeoff and landing vehicle…
Toshiba Memory Europe GmbH (TME) has started sampling the 128GB[1] version of the industry’s first Universal Flash Storage (UFS) Ver.…
Israeli startup Hailo, developers of a proprietary processing architecture for deep learning on edge devices, has expanded its Series A…
TowerJazz, the global specialty foundry leader, and Ranix, a total solution provider for automotive communication and IoT security, today announced…
In 2010, Rohde & Schwarz expanded its product line by adding software based, cloud-enabled solutions from GMIT GmbH. The next…
IC Insights is in the process of completing its forecast and analysis of the IC industry and will present its…
Samsung Electronics, a world leader in advanced semiconductor technology, today introduced its smallest high-resolution image sensor, the ISOCELL Slim 3T2.…
The new Joint Venture will be headquartered at BAE Systems’ facility in Telford, England and will sustain over 400 jobs…
Analog Devices, Inc., (ADI) Technology Fellow Dr. Katsu Nakamura has been named an IEEE Fellow. He is being recognized as…