LATEST NEWS

Dynamic Infrastructure implements deep AI technology to prevent bridges and tunnels from collapsing

The New York and Tel Aviv based startup Dynamic Infrastructure is implementing the world's first deep-learning solution which allows bridge…

7 years ago

ABB unveils end-to-end e-mobility solutions at eMove360°

A world leader in sustainable mobility, ABB showcases the future of charging and distribution solutions – from source-to-socket in Munich…

7 years ago

Infineon announces new microcontroller optimized for automotive 77 GHz radar applications

Munich, Germany – 15 October 2019 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will add a new member…

7 years ago

Rohde & Schwarz, Cardinality and Dell introduce joint telco data analytics solution

Best-of-breed big data analytics with Cardinality’s Perception platform, the new software IP probe R&S®Net Sensor OEM and Dell EMC PowerEdge…

7 years ago

congatec intensifies Eastern European sales and marketing activities

Think globally, act locally Deggendorf, Germany, 10 October 2019 * * *  congatec – a leading supplier of high-performance embedded…

7 years ago

Advantech Opens New Japan Service Center in Nohgata to drive Industry 4.0 Growth

October, 2019 – Advantech (stock code: 2395), a leader in intelligent systems officially opens its new Japan Service Center located…

7 years ago

The Honorable Patrick J. Murphy Joins BAE Systems, Inc. Board of Directors

BAE Systems, Inc. has announced that former Under Secretary of the Army and U.S. Representative Patrick J. Murphy has been…

7 years ago

Nokia celebrates twelve months of 5G achievements

Nokia is celebrating twelve months of 5G ‘firsts’: a milestone defined by 22 game-changing achievements in the field of 5G.     …

7 years ago

Samsung Electronics Develops Industry’s First 12-Layer 3D-TSV Chip Packaging Technology

Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed the industry’s first 12-layer 3D-TSV…

7 years ago