HP Inc. Reinvents Corrugated Packaging Printing in Collaboration with KBA

11 years ago

DS Smith Packaging to install first HP PageWide Web Press T1100S Würzburg, Germany, Dec. 3, 2015 - HP Inc. today…

Xilinx Announces Publicly Available Tools and Documentation for 16nm UltraScale+ Devices

11 years ago

Enabling mainstream market adoption and validation of 2-5X greater system level performance/watt over 28nm devices AN JOSE, Calif., Dec. 8,…

Nationwide DVB-T2 network in Albania uses Rohde & Schwarz solutions

11 years ago

Albania’s public broadcaster RTSH (Albanian Radio and Television) is converting its nationwide broadcast network to DVB-T2. Rohde & Schwarz is…

Going 360 with the Snapdragon 805: How one connected camera sees all in Formula E

11 years ago

Just as the best racers in the FIA Formula E Championship series are surrounded by the best teams, the groundbreaking…

Dialog Semiconductor’s Bluetooth® Smart SoCs Links Wearables to Apps for WeChat Users

11 years ago

London, United Kingdom – December 08, 2015 – Dialog Semiconductor plc (XETRA:DLG), a provider of highly integrated power management, AC/DC power…

Hitachi Automotive Systems Moves into the Fast Lane with 2016 North American International Auto Show Official Sponsorship

11 years ago

Detroit, Michigan, December 7, 2015 --- Hitachi Automotive Systems Americas, Inc. has announced the company's Official Sponsorship of the 2016…

Microsoft HoloLens and Autodesk Fusion 360: Collaboration that could create radical change

11 years ago

We are happy to announce that Microsoft HoloLens is partnering with Autodesk Fusion 360 on a solution that we believe…

Introducing a building block approach using a power component design

11 years ago

The Vicor approach Offers great design flexibility • Enables the designer to optimise system performance through the selection of the…

Imec, Coventor expand collaboration to optimize 7 nm semiconductor manufacturing processes

11 years ago

• Joint development team leverages SEMulator3D to explore semiconductor process variation issues at unprecedented levels • Collaboration team has conducted…

Advantest’s New High-Speed T5851 Semiconductor Memory Tester Provides Versatile, Low-Cost Solution

11 years ago

Tester Enables System-Level Testing of High-Performance Universal Flash Storage and PCIe BGA SSDs for the Rapidly Growing Mobile Electronics Market…