Microchip’s PolarFire® FPGA’s Single-Chip Crypto Design Flow “Successfully Reviewed” By the United Kingdom Government’s National Cyber Security Centre

3 years ago

Security is now an imperative for all designs in every vertical market. Today, system architects and designers received further evidence…

Belden Launches New Solutions to Boost Uptime and Improve Network Connectivity

3 years ago

Releases include expansions to Belden’s OptiTuff line, a new connector and I/O module from Lumberg Automation and updates to Belden’s…

TEL 6 Series Ultra compact 6 Watt DC/DC converter (DIP-16) for industrial applications

3 years ago

Ultra compact 6 Watt converter in DIP-16 metal casing High power density of 1,6W/cm3 6-side shielded metal case with insulated…

Autotalks and Hyundai Mobis collaborate to implement cutting-edge V2X technology for connected cars

3 years ago

Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, and Hyundai Mobis, a leading global automotive supplier, are set to…

ROHM’s New Automotive-Grade High Voltage Hall ICs

3 years ago

Provides class-leading* withstand voltage along with a wide operating voltage range ROHM has developed Hall ICs, the BD5310xG-CZ / BD5410xG-CZ…

Harwin extends its multi-directional spring contact offering with new height options

3 years ago

Harwin announces four new height options to its multi-directional spring contact range, which now spans from 4.00mm to 10.00mm. The…

Nexperia expands portfolio to include first integrated 5 V load switch

3 years ago

Nexperia, the essential semiconductor expert, today announces the expansion of its analog and logic product portfolio with the introduction of…

Deci Releases Powerful Open-Source Generative AI Model, DeciCoder, to Redefine Code Generation for Developers

3 years ago

Deci, the deep learning company harnessing AI to build AI, today released DeciCoder, its inaugural foundation model in generative AI…

Tianneng selects Siemens Xcelerator for intelligent battery manufacturing

3 years ago

Tianneng will build a development and production software platform using Siemens Xcelerator to speed the company's digital transformation and help…

Samsung Expands Collaboration With Intel To Advance vRAN Innovation

3 years ago

New product innovation agreement will deliver cutting-edge vRAN solutions with enhanced performance to meet rising capacity demands Samsung Electronics today…