USB µModule Transceiver Protects Systems with 7500VRMS of Galvanic Isolation

9 years ago

MILPITAS, CA – November 22, 2016 – Linear Technology Corporation introduces the LTM2894, a USB µModule® (micromodule) reinforced isolator that…

New-Tech Europe | Nov 2016 | Digital Edition

9 years ago

New-Tech Europe | November 2016 | Digital edition

The logistics of the future: from data goggles to electric trucks

9 years ago

Munich. The BMW Group will increasingly rely on innovation, digitalisation and sustainability for logistics in the future. A fully-networked supply…

ROHM Semiconductor awards Future Electronics as Distributor of the Year

9 years ago

Future Electronics has been awarded EMEA Distributor of the Year by ROHM Semiconductor during electronica 2016 in Munich. The award…

MACOM Announces Definitive Agreement to Acquire AppliedMicro

9 years ago

MACOM Technology Solutions Holdings, Inc.  (NASDAQ: MTSI) (“MACOM”), a leading supplier of high-performance analog RF, microwave, millimeterwave and photonic semiconductor…

Infineon complements iMOTION™ Modular Application Design Kit with two power boards

9 years ago

Munich, Germany – November 22, 2016 – Infineon Technologies AG (FSE: IFX / OTCQX) adds two power boards to the…

Vishay Intertechnology Bidirectional 1500 W PAR® TVS Offer High Power Density to Save Board Space and Lower Costs

9 years ago

Surface-Mount Devices Feature eSMP® SMPC (TO-277A) Package With Low 1.1 mm Profile MALVERN, Pa. — Nov. 21, 2016 — Vishay…

100V, 600mA, Synchronous Step-Down Delivers Over 93% Efficiency

9 years ago

MILPITAS, CA - November 21, 2016 - Linear Technology Corporation announces the LT8630, a 600mA, 100V input capable synchronous step-down…

Maxim’s DeepCover® Secure Microcontroller Simplifies EMV Contactless Payment Terminals

9 years ago

MAX32560 integrates security features and payment interfaces to meet latest PCI-PTS standards and reduce development time MUNICH, Germany, and CANNES,…

Leti Announces H2020 Project to Develop Si-photonics-based Transceivers for Low-cost, High-speed Data Communications

9 years ago

COSMICC, Horizon 2020 Project, Combines CMOS Electronics and Silicon Photonics With Innovative High-throughput, Fiber-attachment Techniques To Reach beyond 1 Tb/s…