Ericsson and Cisco extend strategic partnership to include new Wi-Fi solutions

10 years ago

New Wi-Fi solutions - Evolved Wi-Fi Networks (EWN) - combine industry-leading wireless technologies from the two companies EWN includes pre-integrated…

NXP and Geely Announce Strategic Partnership for Automotive Research and Development

10 years ago

At CES® 2017, NXP Semiconductors (NASDAQ:NXPI), the world’s leading provider of automotive electronics solutions, announced a long-term strategic partnership with…

Intel Unveils Compute Card, a Credit Card-Sized Compute Platform

10 years ago

Today, Intel is announcing a new modular compute platform called the Intel® Compute Card along with a range of partners…

Harwin increases design choices and production flexibility with extensions to 1.27mm, 2mm and 2.54mm pitch connector ranges

10 years ago

Harwin has extended the number of models available in its highly successful Industry Standard Connector ranges, including Harwin’s Archer M50…

Piloted driving with artificial intelligence: Audi partnering with top companies in the electronics industry

10 years ago

Artificial intelligence (AI) is a key technology for piloted driving – that’s why Audi and strong partners from the electronics…

Maxim Announces Industry’s First Remote Tuner Solution with Single Hardware Platform Supporting Worldwide Radio Standards for Automotive Applications

10 years ago

MAX2175 RF to Bits® tuner-based solution reduces cables and simplifies vehicle head unit design San Jose, CA—January 4, 2017—Using the…

Leading automotive supplier demonstrates Ultrahaptics’ mid air haptics in concept car at CES® 2017

10 years ago

Bristol, UK – 5th January 2017. Ultrahaptics today announced that its touch-free haptic feedback  solution is integrated into a new…

Renesas Electronics and TTTech Deliver Highly Automated Driving Platform Providing Faster Track to Mass Production

10 years ago

SANTA CLARA, CALIF., VIENNA, Austria, January 5, 2017 — Renesas Electronics Corporation (TSE: 6723, Renesas), a premier provider of advanced semiconductor…

Dassault Systèmes Boosts Experience-Thinking Innovation on the 3DEXPERIENCE Platform with the HTC Vive Business Edition

10 years ago

VELIZY-VILLACOUBLAY, France and LAS VEGAS — January 5, 2017 — Dassault Systèmes (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world…

ASUS relies on Infineon REAL3™ image sensor chip to bring Augmented Reality into compact smartphones

10 years ago

Munich, Germany, and Las Vegas, NV, USA – January 5, 2017 – The REAL3™image sensor chip from Infineon Technologies AG…