NXP Semiconductors N.V. (NASDAQ:NXPI), today announced it will add five additional years to the longevity program for six S08 8-bit…
Silicon Labs (NASDAQ: SLAB) has launched two new wireless occupancy sensor and smart outlet reference designs for the home automation…
At last week’s IEEE International Electron Devices Meeting (IEDM) in San Francisco (USA), imec, the world-leading research and innovation hub…
Molex introduces the hermaphroditic CyClone Panel-to-Panel Connector System designed for secure high-mating cycle connections. The CyClone connector modules offer 10,000…
The Centre for Process Innovation (CPI) has won a building integrated photovoltaic (BIPV) Initiative award at the 2016 smart solar…
Trial architecture to evaluate how cloud-optimized radio access macro network architectures will enable smooth operator transition from 4G to 5G…
Nissha Printing Co., Ltd.(TYO 7915), a leading manufacturer of In-Mold Decoration (IMD) parts for automotive and home appliance OEMs, today…
One of the most technologically advanced sports coupes in the world features Media Oriented Systems Transport (MOST®) technology for powering…
adidas today announced that it will be making its 3D technology shoes available to purchase for the first time with…
With its tiny 1.2mm x 1.3mm outline and typical current of only 900nA, the TSU111 nano-power op amp from STMicroelectronics…