SANTA CLARA, CALIF., VIENNA, Austria, January 5, 2017 — Renesas Electronics Corporation (TSE: 6723, Renesas), a premier provider of advanced semiconductor…
VELIZY-VILLACOUBLAY, France and LAS VEGAS — January 5, 2017 — Dassault Systèmes (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world…
Munich, Germany, and Las Vegas, NV, USA – January 5, 2017 – The REAL3™image sensor chip from Infineon Technologies AG…
The new Kaby Lake processors are manufactured in 14 nm technology, as the former 6th generation Intel® Core™ processors, and…
2017 will witness the arrival on the market of the first Bluetooth 5 products which, with twice the datarate and…
BMW Group, Intel and Mobileye will have autonomous test vehicles on the roads by the second half of 2017 The…
Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, International, Ltd., has introduced active noise cancelling (ANC) technology…
STMicroelectronics (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronics applications, has boosted performance and…
Qorvo® (Nasdaq:QRVO), a leading provider of innovative RF solutions that connect the world, today introduced a complete system on chip…
Faraday Future (FF) has revealed FF 91 (“nine one”), its first production vehicle, at an exclusive event prior to the…