Vishay Intertechnology Introduces New Series of Sulfur-Resistant Long Side Termination Thick Film Chip Resistors

9 years ago

Vishay Intertechnology, Inc. (NYSE: VSH) today released a new series of sulfur-resistant long side termination thick film chip resistors optimized…

Fourth-Generation 600 V E Series Power MOSFET Lowers Conduction and Switching Losses, Increases Efficiency

9 years ago

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first device in its fourth generation of 600 V E Series power…

MIT Hyperloop MIT is one of 30 student teams testing high-speed concept pods as part of a SpaceX Hyperloop competition.

9 years ago

A team of MIT student designers is heading to California with a concept pod, a vision for the future of…

CPI to launch new facility to realise opportunities in the Internet of Things

9 years ago

CPI has announced the start of a new project to address the manufacturing challenges and exploit the commercial opportunities offered…

Cypress Offers Enhanced Security, Reliability and Performance for Automotive, Industrial and IoT Applications with New FL-L NOR Flash Memories

9 years ago

New 64Mb and 128Mb Quad SPI Devices Join 256Mb Density Devices in 3.0V Family with 4KB Uniform Sector Size, AEC-Q100…

0.33-inch full-HD DLP® Pico™ chipset from Texas Instruments is industry’s smallest 1080p display solution with unmatched brightness capabilities

9 years ago

As brands and developers have been eagerly awaiting a solution that will allow them to create smaller form factor products…

Swedish solar energy expert Midsummer’s client now produces lightweight flexible solar modules with conversion efficiency at 14 per cent

9 years ago

Midsummer, a leading supplier of production lines for cost effective manufacturing of lightweight flexible CIGS solar cells, today announced that…

TOSHIBA ADDS 7TH GENERATION INTEL PROCESSORS TO MOBILE SOLUTIONS PORTFOLIO

9 years ago

Toshiba’s Client Solutions Division (CSD), a division of Toshiba America Information Systems, Inc., today announced the addition of the 7th…

NXP Shareholders Approve All Items Proposed Relating To Qualcomm’s Tender Offer

9 years ago

NXP Semiconductors N.V. (NASDAQ:NXPI) announced that, during an extraordinary general meeting of shareholders (EGM) held today, NXP obtained shareholder approval…

BAE Systems signs Heads of Agreement for a future contract with Turkish Aerospace Industries for TF-X Programme

9 years ago

Ankara, Turkey: In the presence of The Prime Ministers of Turkey and the United Kingdom, BAE Systems and Turkish Aerospace…