X-FAB and Exagan Successfully Produce First GaN-on-Silicon Devices on 200-mm Wafers

9 years ago

Silicon Foundry and GaN Start-Up Achieve Major Milestone in Establishing a 200-mm, Fully CMOS-Compatible Process While GaN Power Products Gain…

1000 km range thanks to a new battery concept

9 years ago

Depending on the model, electric cars are equipped with hundreds to thousands of separate battery cells. Each one is surrounded…

Intel at AUVSI XPONENTIAL 2017: Intel Takes Flight with New Capabilities and Solution

9 years ago

Today at AUVSI XPONENTIAL, Intel CEO Brian Krzanich took the stage to deliver the show’s opening keynote, sharing the latest…

Ericsson introduces Dynamic Orchestration

9 years ago

Ericsson (NASDAQ: ERIC) launches its Dynamic Orchestration solution to facilitate the rapid introduction and closed-loop automation of services across physical…

STMicroelectronics Delivers New STM32L4 MCUs with On-Chip Digital Filter, Supported by Extended Development Ecosystem

9 years ago

STMicroelectronics has begun volume production of ultra-low-power STM32L45x microcontrollers (MCUs), supported by a development ecosystem based on the easy-to-use and…

Toshiba Adds 60V and 100V Products to High Current Photorelays with S-VSON4, the Industry’s Smallest Packag

9 years ago

TOKYO–Toshiba Corporation's (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of new two high current products,…

Nokia joins ‘Smart Tampere’ initiative to help bring smart city services to one of Finland’s largest municipalities

9 years ago

Espoo, Finland - Nokia has joined 'Smart Tampere', an initiative to introduce smart city services that will foster economic development…

Advantest Europe and Nash Technologies Develop Long-term Partnership for Application Engineering Services

9 years ago

Advantest Europe GmbH and Nash Technologies GmbH today announced a strategic partnership to develop solutions for test of semiconductor devices.…

Vicor Expands High Voltage Bus Converter Family with New K=1/16, 384VDC-24VDC in a ChiP Package

9 years ago

The new BCM6123TD1E2663Txx is a high-density, high-efficiency, fixed ratio DC-DC converter module in a ChiP package, which operates from a…

Xilinx Spartan-7 FPGAs Now in Production

9 years ago

Today announced that its Spartan®-7 family of FPGAs is now available for order and shipping to standard lead times. As a…