Designed to provide VR specialists with a durable and manageable solution for capturing, viewing and editing VR content Samsung Electronics introduces the 360…
Smallest footprint; up to 25% space-saving; all-metal package; secure connection to PCB OMC, the pioneer in optoelectronics manufacturing, has launched…
The Modular Telematics Platform (MTP) from STMicroelectronics provides an open development environment for prototyping advanced Smart Driving applications, including vehicle connectivity to…
Engineers have developed a ‘skin’ for robots and prosthetics that could massively boost their dexterity when handling objects. Bio-inspired, the…
Samsung’s Secure Element solution features eFlash memory and new dedicated security software Samsung Electronics, a world leader in advanced semiconductor…
IC Insights Raises 2017 IC Market Forecast to +22% Strong growth to be driven by a 74% surge in the…
Lord Callanan, Minister for Aviation and lead minister in the House of Lords for the Space Industry Bill, along with…
Dutch officials toasted on Tuesday the opening of what is being called the world's first 3D-printed concrete bridge, which is…
SEOUL, Oct. 19, 2017 — LG Electronics (LG) announced that it is teaming up with Qualcomm to jointly develop a…
8nm LPP is now ready for production, targeting high performance applications Samsung Electronics, a world leader in advanced semiconductor technology,…