The Swiss Team has won the Solar Decathlon competition

9 years ago

The Swiss team and their solar house, the NeighborHub, won the prestigious Solar Decathlon 2017 competition in the Unites States.…

NXP Announces New Automotive Processing Platform that Brings Future Vehicles to Market Faster

9 years ago

SAN JOSE, Calif., Oct. 16, 2017 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ:NXPI), the world’s largest supplier of automotive semiconductors3,…

Analog Devices’ Wideband RF Power and Return Loss Measurement System Offers a Smaller Form Factor and Faster Time to Market

9 years ago

Analog Devices, Inc. today introduced a 9 KHz - 7 GHz directional bridge and dual RMS RF power detector that can…

GoFly Launches Competition to Bring Personal Flying Devices to the Masses

9 years ago

Boeing to Sponsor $2 Million, Two-Year International Incentive Competition  A new competition to encourage innovators to create a safe and…

Next Generation Advanced Instrumentation and Defense Applications Enabled by Analog Devices’ High-Speed A/D Converter

9 years ago

Analog Devices, Inc. today announced a 14-bit, 2.6 GSPS dual A/D converter which enables IF/RF sampling with superior speed and linearity.…

15 Millions more for Heliatek

9 years ago

New and existing investors increase financial resources to accelerate development and speed up worldwide market entry Dresden, Germany – 12th October…

Intel FPGAs Power Acceleration-as-a-Service for Alibaba Cloud

9 years ago

Intel today announced that Intel® field programmable gate arrays (FPGAs) are now powering the Acceleration-as-a-Service of Alibaba Cloud*, the cloud…

Infineon partners with Smart Wires to shape up existing grids for renewables

9 years ago

Munich, Germany and Milpitas, CA, USA – 13 October 2017 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is…

Samsung’s New Image Sensors Bring Fast and Slim Attributes to Mobile Applications

9 years ago

Samsung releases ISOCELL Fast 2L9 with Dual Pixel technology and ISOCELL Slim 2X7 with Tetracell technology Samsung Electronics, a world…

IC Makers Maximize 300mm, 200mm Wafer Capacity

9 years ago

A total of 25 new 300mm wafer fabs is expected between 2016 and 2021 as the outlook for 450mm wafers…