Samsung Addresses IoT Data Security at the Chip Level with New Hardware/Software Turn-Key Solution

9 years ago

Samsung’s Secure Element solution features eFlash memory and new dedicated security software Samsung Electronics, a world leader in advanced semiconductor…

IC Insights Raises 2017 IC Market Forecast to +22%

9 years ago

IC Insights Raises 2017 IC Market Forecast to +22% Strong growth to be driven by a 74% surge in the…

Teledyne e2v welcome Lord Callanan and senior representatives of the Space Industry to discuss the pending UK Space Industry Bill

9 years ago

Lord Callanan, Minister for Aviation and lead minister in the House of Lords for the Space Industry Bill, along with…

Dutch open ‘world’s first 3D-printed bridge’

9 years ago

Dutch officials toasted on Tuesday the opening of what is being called the world's first 3D-printed concrete bridge, which is…

LG AND QUALCOMM TO JOINTLY RESEARCH AND DEVELOP NEXT-GEN CONNECTIVTY SOLUTIONS FOR CARS

9 years ago

SEOUL, Oct. 19, 2017 — LG Electronics (LG) announced that it is teaming up with Qualcomm to jointly develop a…

Samsung Completes Qualification of 8nm LPP Process

9 years ago

8nm LPP is now ready for production, targeting high performance applications Samsung Electronics, a world leader in advanced semiconductor technology,…

Verizon, Qualcomm and Novatel Wireless Announce Collaboration to Expedite Trials and Wide-scale Commercial Deployment of 5G NR mmWave Technology

9 years ago

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), and Novatel Wireless, an Inseego company, announced plans to collaborate…

Stella Vie wins World Solar Challenge 2017

9 years ago

Solar Team Eindhoven has won the 2017 World Solar Challenge Cruiser Class Division in their Stella Vie solar car, with…

STMicroelectronics’ Advanced Automotive Processors with Built-In Security Set to Protect Connected Cars against Cyber Threats

9 years ago

New processors combine ST’s automotive and security expertise to meet demanding safety, reliability, and quality standards Market’s first implementation of…

Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New Automotive MCU Solution

9 years ago

Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New Automotive MCU Solution Cypress Semiconductor Corp.…