Stratasys Ltd. (NASDAQ: SSYS), a global leader in applied additive technology solutions, announced today the development of a new metal…
Rohde & Schwarz and Unigroup Spreadtrum & RDA, a world-leading fabless semiconductor company with advanced technology in mobile communications and IoT, are…
u‑blox (SIX:UBXN), a global leader in wireless and positioning modules and chips, announced that its SARA-N2 NB-IoT module series is…
congatec - a leading vendor of standardized and customized embedded computer boards and modules - introduces a deployment ready design…
Siemens was awarded top honors for its idea management program at the German congress of the Zentrum Ideenmanagement ("Idea Management…
BrainChip Holdings Ltd. (“BrainChip” or the “Company”) (ASX: BRN), a leading developer of software and hardware accelerated solutions for advanced…
KEMET, a leading global supplier of electronic components, today announced new patented KONNEKT technology enabling high power density by combining multiple components…
Ficosa, a top-tier global provider devoted to the research, development, manufacturing and marketing of high-technology vision, safety, connectivity and efficiency…
The world-leading research and innovation hub in nanoelectronics and digital technologies, imec, and Cadence Design Systems, Inc. (NASDAQ: CDNS) today…
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity…