The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more…
Rohde & Schwarz and CommSolid have successfully completed the verification of 3GPP Release 14 location services (LCS), which is one of…
Munich, Germany, and Durham (NC), USA – 26 February 2018 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and…
Developers can now develop IoT products from the cloud without writing embedded code. GNSS/cellular matching enhances performance, while improved power…
Available exclusively through RS, new Clicker 2 for PSoC® 6 kit maximises ease of use and click board™ expandability for…
Australian researchers from the ARC Centre of Excellence for Nanoscale BioPhotonics (CNBP) have developed a 3D printable ‘clip-on’ that can…
Swisscom and Ericsson (NASDAQ:ERIC) are closely collaborating on end-to-end network slicing for critical communications in a joint project to deploy…
TT Electronics, a global provider of engineered electronics for performance critical applications, has announced the LRMAP5930 series of low resistance,…
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today unveiled…
ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, has announced the latest set of USB-C (Type-C) devices that are fully compliant…