Qualcomm Incorporated (NASDAQ:QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., has introduced the new Qualcomm® Snapdragon™ 700 Mobile Platform Series, designed…
AMARO (Italy), February 28, 2018 – AAEON Technology Europe BV to launch a partnership with Eurotech to integrate ESF (Everyware…
element14.com, the community for engineers, has launched a new Design Challenge called “Bluetooth Unleashed.” This latest challenge encourages designers and…
AMES, Iowa – A new smart and responsive material can stiffen up like a worked-out muscle, say the Iowa State…
In the future, will people have virtual twins to help monitor their health? That is what Health EU is proposing.…
Teledyne e2v has revealed the QLS1046-4GB, an ultra-compact computing module combining the NXP LS1046 Arm® based processor with 4GB DDR4…
GE Healthcare’s most advanced radiology ultrasound system – the LOGIQ™ E10 – offers 48X data throughput and 10X processing power…
Company’s eSIM family includes the SN100U, the world’s most integrated “all-in-one” chipset featuring NFC, Secure Element, and eSIM and the…
50 V silicon carbide Schottky diodes feature superior switching performance and higher reliability APEC 2018 – Booth #601 – SAN…
Intel today unveiled “Intel AI: In Production,” a new program that makes it easier for developers to bring their artificial…