XEV says its 3D printed electric car is ready for mass production

8 years ago

Italian company X Electrical Vehicle (XEV) says its 3D printed electric car, the LSEV, will be ready for mass production…

Ericsson MediaFirst TV platform available on Amlogic’s Set Top Box Chipset

8 years ago

Next-generation TV operators can cost-effectively take their customers to new levels of personalized consumer experience satisfaction as a result of…

Using 24 GHz Radar to Speed Commercial UAV Adoption

8 years ago

Over the last decade, unmanned aerial vehicles and systems (UAV and UAS)—also referred to as drones—have become widely popular and…

Marvell Introduces Industry’s First NVMe Chipset Solutions to Address Emerging Data Center SSD Requirements

8 years ago

Marvell (NASDAQ:MRVL), a leader in storage, networking and connectivity semiconductor solutions, today announced that it is launching innovative NVM Express®…

Toshiba launches 1.5A LDO regulators in ultra-small package

8 years ago

Toshiba Electronics Europe has started shipping a new low-dropout (LDO) regulator series in the industry’s smallest WCSP6F package measuring just…

KLA-Tencor Announces Agreement to Acquire Orbotech Ltd.

8 years ago

- Extends KLA-Tencor's technology and market reach within the electronics value chain- Expands KLA-Tencor's addressable market by $2.5 billion in…

Golden touch: next-gen optical disk to solve data storage challenge

8 years ago

Scientists from Australia and China have drawn on the durable power of gold to demonstrate a new type of high-capacity…

WE-KI HC and WE-CAIR Inductive Component Series in Simulation

8 years ago

As part of their Microwave Global Models™ cooperation, Würth Elektronik eiSos and Modelithics make two more Würth Elektronik eiSos product…

Samsung Enables Premium Multimedia Features in High-End Smartphones with Exynos 7 Series 9610

8 years ago

Samsung Electronics, a world leader in advanced semiconductor technology, today announced the availability of its latest application processor (AP), the…

Maxim’s Himalaya uSLIC Solution, the Industry’s Smallest Power Modules, Revolutionizes Design for Highly Space-Constrained Applications

8 years ago

Designers working on space-constrained applications can now dramatically reduce solution size and increase efficiency with the family of micro system-level…