Munich. At the BMW Group, the use of 3D-printed components is on the rise. Over the last decade alone, the…
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced a new 130nm manufacturing process node based FFSA™ (Fit Fast Structured…
BlueNRG-Tile is the core of a new all-in-one IoT-node development kit from STMicroelectronics. The very small tile/coin is built around ST’s…
IC Insights’ November Update to the 2018 McClean Report, released later this month, includes a discussion of the forecasted top-25 semiconductor suppliers in…
Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced the availability of an automotive-qualified USB-C controller with USB…
Siemens and Aruba, a Hewlett Packard Enterprise company, today announced a strategic partnership focused on bridging the Operational Technology (OT)…
What’s New: Intel today announced the Intel® XMM™ 8160 5G modem, a multimode modem optimized to provide 5G connectivity to devices…
Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced it is expanding its strategic technology…
ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, has released a new version of its iAQ-Core…
The new power supply series consists of the R&S NGE102B with two channels and the R&S NGE103B with three channels. They are suitable for…