TDK Corporation (TSE 6762) announces the introduction of multiple option configurations for the TDK-Lambda brand ZWS-C series of 10, 15,…
Introducing MECC: A seamless, scalable solution to unlock global IoT connectivity using nRF9151 module Nordic Semiconductor, a global leader in…
TOLL package 650V GaN HEMTs contribute to improving power supply efficiency Willich-Münchheide, Germany, March 05, 2025 – ROHM has announced that…
Development tool offers powerful debugging at a more affordable price for professional engineers, students and hobbyists alike To make its…
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the addition of P-channel power MOSFETs to its family of radiation-tolerant…
Powerful chipset features 98 percent efficiency in a compact, thermally efficient package Power Integrations (NASDAQ: POWI), the leader in high-voltage…
Salt Security, a leading API security company, today announced that CRN®, a brand of The Channel Company, has named it…
Leveraging Arm Neoverse CPUs, Ceva’s Hardware Accelerated 5G NR Baseband Platform and SynaXG’s 5G NR RAN Expertise, customized baseband processing…
Tria™ creates embedded modules using Qualcomm Technologies, Inc. Stutensee, Germany – March 4, 2025 –Tria Technologies, an Avnet company specializing…
ARMONK, N.Y., Feb. 26, 2025 /PRNewswire/ -- IBM (NYSE: IBM) today debuted the next generation of its Granite large language model (LLM) family, Granite…