ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today launched a miniature spectral sensor chip that…
LG Electronics (LG) president and CTO Dr. I.P. Park outlined the company’s vision for the future in his CES 2019…
Toshiba Memory Europe announced the introduction of the fourth generation of its single package ball grid array (BGA) solid state…
he University of Southampton’s pioneering contribution to optical fibre technology that now enables the internet to span the world has…
The bi-directional downlink and uplink data call was made at the Ericsson Lab in Kista, Sweden last December 20. It…
At the start of 2019, Dr. Falk Herrmann was appointed the new CEO of Rohde & Schwarz Cybersecurity GmbH. The mechanical engineer gained…
Samsung Electronics and KDDI today announced that they have successfully completed a 5G test with real time transmission of 4K…
The two-year Models for the Manufacturing of Particulate Process (Models MPP) project focused on establishing a generic framework and core…
Flex Power Modules is introducing new DC-DC power modules for the industrial and railways sectors, broadening its product range to…
The first 5G data video call over 600 MHz included successful uplink and downlink communication and was carried out on…