University’s contribution to global technology recognised in UK’s Best Breakthroughs list

8 years ago

he University of Southampton’s pioneering contribution to optical fibre technology that now enables the internet to span the world has…

Ericsson and Qualcomm complete 5G data call on 2.6 GHz band

8 years ago

The bi-directional downlink and uplink data call was made at the Ericsson Lab in Kista, Sweden last December 20. It…

Falk Herrmann appointed new CEO of Rohde & Schwarz Cybersecurity

8 years ago

At the start of 2019, Dr. Falk Herrmann was appointed the new CEO of Rohde & Schwarz Cybersecurity GmbH. The mechanical engineer gained…

Samsung and KDDI Demonstrate Real Time 4K Video Communication Powered by 5G at a Japanese Train Station

8 years ago

Samsung Electronics and KDDI today announced that they have successfully completed a 5G test with real time transmission of 4K…

CPI Supports Project to Improve Industrial Productivity

8 years ago

The two-year Models for the Manufacturing of Particulate Process (Models MPP) project focused on establishing a generic framework and core…

Flex Power Modules broadens portfolio to meet rising demand in industrial and railways sectors

8 years ago

Flex Power Modules is introducing new DC-DC power modules for the industrial and railways sectors, broadening its product range to…

T-Mobile, Ericsson and Intel successfully complete first 5G call on 600 MHz

8 years ago

The first 5G data video call over 600 MHz included successful uplink and downlink communication and was carried out on…

Qualcomm Chipsets and RF Front End Power More than 30 Commercial 5G Mobile Devices Scheduled to Launch in 2019

8 years ago

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated (NASDAQ: QCOM), today announced strong 5G device momentum with more than 30…

2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration

8 years ago

Today at CES 2019 in Las Vegas, Intel unveiled the next wave of PC innovation that will advance the PC…

Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

8 years ago

Cree, Inc. (Nasdaq: CREE) announces that it signed a multi-year agreement to produce and supply its Wolfspeed® silicon carbide (SiC)…